Updated on 2024/03/25
Graduate School of Engineering Division of Science and Engineering for Materials, Chemistry and Biology
Professor 2022.04 - Now
School of Engineering Department of Chemical Engineering
Professor 2022.04 - Now
博士（工学） （ Others ）
Environmental Science/Agriculture Science / Environmental load reduction and remediation / 環境技術・環境材料
Nanotechnology/Materials / Nano/micro-systems / マイクロ・ナノデバイス
Nanotechnology/Materials / Thin film/surface and interfacial physical properties / 薄膜・表面界面物性
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment / 機能材料・デバイス
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electric and electronic materials
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment
Nanotechnology/Materials / Thin film/surface and interfacial physical properties
Nanotechnology/Materials / Inorganic materials and properties
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Chemical reaction and process system engineering
半導体プロセス工学 半導体デバイス 化学気相合成 化学反応速度論 半導体材料工学
CVDによるエネルギーデバイス用材料の製膜と評価
CVDによるダイヤモンド薄膜の高品質化
CVDによるハードコーティング
ダイヤモンド用コンタクト材料
めっきにおける吸・脱着現象の解明
半導体デバイス用配線材料のプロセス工学
ワイドバンドギャップ材料
強誘電体材料
材料プロセス工学
化学気相成長（CVD)の反応工学
鉄鋼協会
2015.01 - Now Domestic
IEEE（米国電気電子技術者協会）
2013.07 - Now Overseas
電気化学会
2010.10 - Now Domestic
CVD研究会
2010.10 - Now Domestic
表面技術協会
2009.04 - Now Domestic
エレクトロニクス実装学会
2007.04 - Now Domestic
ニューダイヤモンドフォーラム
2005.04 - Now Overseas
Materials Research Society(U.S.A)
2005.04 - Now Overseas
ニューダイヤモンドフォーラム
1995.04 - Now Domestic
化学工学会
1995.04 - 1998.03 Domestic
Materials Research Society(U.S.A)
1995 - Now Overseas
Electrochemical Scociety
1995 - Now Overseas
電子情報通信学会
1991.04 - 1995.03 Domestic
応用物理学会
1991.01 - Now Domestic
化学工学会
1990.04 - 1995.03 Domestic
第１３回貴金属に関わる研究助成金 シルバー賞
2012.03 田中貴金属販売株式会社
第１２回貴金属に関わる研究助成金 MMS賞
2011.03 田中貴金属販売株式会社
第１１回貴金属に関わる研究助成金 MMS賞
2010.03 田中貴金属販売株式会社
優秀発明賞
2001.06 富士通株式会社
151 2023.12（ ISSN:00262714 ）
Improvement of the heat resistance of a liquid mold compound by bismaleimide resin
Yuki Ishikawa, Tomoya Takao, Takeyasu Saito
Microelectronics Reliability 143 2023.04
VUVによるエポキシ系樹脂の表面改質と異種界面強度の評価
齊藤 丈靖, 白樫 陽菜, 西浦 拓海, 遠藤 真一, 石川 有紀, 岡本 尚樹
エレクトロニクス実装学術講演大会講演論文集 37 ( 0 ) 14B1-4 2023.03
反応性スパッタリングによるTi系およびV系MAX合金薄膜の物性に及ぼすA元素とX元素の効果
齊藤 丈靖, 若松 和伸, 上田 和貴, 岡本 尚樹
エレクトロニクス実装学術講演大会講演論文集 37 ( 0 ) 15B5-2 2023.03
Evaluation of Reactive Sputtered Ti-group MAX Alloy with Different A Elements for Wiring Material
2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings 2023（ ISBN:9798350310979 ）
Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition
N. Okamoto, H. Tamura and T. Saito
Proc. ADMETA Plus 2021 A-21-P3 2022.10
Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic property Reviewed
N. Okamoto, N. Matsuda, T. Saito
Proc. SSDM2021 C-6-03 2022.09
Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evalua-tion of its electrochemical property Reviewed
N. Okamoto, H. Tamura and T. Saito
Proc. SSDM2021 C-6-04 2022.09
Pulsed Laser Deposition of Ti-Based MAX Compounds for Next-Generation Wiring Technology Reviewed
K. Wakamatsu, T. Saito and N. Okamoto
Proc. 239th ECS Meeting E02-0932 2022.05
Electrodeposition of ZnS and evaluation of its electrochemical property
N. Okamoto, N. Matsuda and T. Saito
J. J. Appl. Phys. 61 ( SC ) SC1075 2022.03
Morphology Control and Charge/Discharge Characteristics of Bi Anode Materials by Pulsed Electrodeposition
Proceedings of Microelectronics Symposium 32 ( 0 ) 195 - 198 2022
Effect of M elements in Reactive sputtered MAX alloy thin film
Proceedings of Microelectronics Symposium 32 ( 0 ) 235 - 238 2022
Effect of A Elements of Reactive Sputtered Ti-based MAX Alloy Thin Films on Physical Properties
Proceedings of Microelectronics Symposium 32 ( 0 ) 67 - 70 2022
Ultra-thin and Smooth Electroless NiB Films on Organosilane Treated SiO2
Proceedings of Microelectronics Symposium 32 ( 0 ) 55 - 58 2022
Preparation of Furfural Resin-Based Active Carbon with Acid Treated Pore Surface Electric Double Layer Capacitor Reviewed
K. Hokari, S. Shimizu, N. Okamoto, T. Saito I. Ide, M. Nishikawa and Y. Onishi
Proc. 239th ECS Meeting A03-0237 2021.05
Surface Structure Control and Charge/Dischage Characteristics of Bismathb Anode Materials by Electrodeposition for Magnesium-Ion Batteries Reviewed
N. Narumoto, N. Okamoto and T. Saito
Proc. 239th ECS Meeting A06-0413 2021.05
Comparative Study of Sheet Resistance Stability of Electro-Deposited Ni/Co – Alloy Thin Films
M. Rindo, N. Okamoto, T. Saito and A. Kitajima
Proc. 239th ECS Meeting E02-0931 2021.05
Surface structure control and charge/discharge characteristics of bismuth anode materials by electrodeposition for magnesium-ion batteries
Natsuki Narumoto, Naoki Okamoto, Takeyasu Saito
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 2021.03（ ISSN:0957-4522 ）
電析法によるビスマス負極材の表面構造制御と充放電特性 Reviewed
成本夏輝,岡本尚樹,齊藤丈靖
第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 59 - 62 2020.09
酸素アニールによるITO電極表面状態と(Pb,La)(Zr,Ti)O3キャパシタの劣化特性 Reviewed
石田裕紀,岡本尚樹,齊藤丈靖,
第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 209 - 212 2020.09
次世代ロジックデバイス配線に向けた無電解NiBめっき膜のバリア性能と電気特性評価 Reviewed
林藤壮史,岡本尚樹,齊藤丈靖,北島彰
第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 127 - 130 2020.09
フラン樹脂由来活性炭への酸性表面官能基の導入と電気二重層キャパシタ特性 Reviewed
清水翔太,帆苅奏,岡本尚樹,齊藤丈靖,井手勇,西川昌信,大西慶和
第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 79 - 82 2020.09
Structural Analysis of Furfural Resin-based Active Carbon to Control an Electric Double-layer Capacitor Reviewed
K. HOKARI, S. SUZUKI, N. OKAMOTO, T. SAITO, I. IDE, M. NISHIKAWA, Y. ONISHI
Electrochemistry 雑誌 The Electrochemical Society of Japan 88 ( 3 ) 127 - 131 2020.04
Suppression of Killer Defects in Diamond Vertical-Type Schottky Barrier Diodes’ A. Kobayashi
S. Ohmagari, H. Umezawa, D. Takeuchi, T. Saito
Jpn. J. Appl. Phys. 雑誌 59 2020
Thermally stable heavily boron-doped diamond resistors fabricated via selective area growth by hot-filament chemical vapor deposition
Shin-ichiro Suzuki, Shinya Ohmagari, Hiroyuki Kawashima, Takeyasu Saito, Hitoshi Umezawa, Daisuke Takeuchi
THIN SOLID FILMS 680 81 - 84 2019.06（ ISSN:0040-6090 ）
Electrodeposition of Cu Doped ZnS and Evaluation of its Photocatalytic Property Reviewed
N. Matsuda, T. Saito, N. Okamoto
Proc. of 2019 International Conference on Electronics Packaging (ICEP) 雑誌 8733595 424 - 427 2019
Highly Reliable (Pb,La)(Zr, Ti)O 3 Ferroelectric Capacitor with Sputtered Sn-Doped In 2 O 3 Electrode
T. Saito, A. Kobayashi, Y. Takada, N. Okamoto
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌 ( 8660850 ) 2019
ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed
H. Kashima, N. Okamoto, T. Saito
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌 ( 8660865 ) 2019
Synthesis of Iron Sulfide by Using Electrodeposition Method and Discussion of the Influence of Solvent
H. Tamura, N. Okamoto, T. Saito
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌 ( 8660938 ) 2019
Structural Analysis and Electric Double Layer Capacitor of Furfural Resin-Based Active Carbon with Different Particle Size Reviewed
K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I.Ide, M. Nishikawa, Y. Onishi,
Proc. of 2019 International Conference on Electronics Packaging (ICEP 2019) 雑誌 ( 8733546 ) 441 - 443 2019
ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed
H. Kashima, N. Okamoto, and T. Saito
2018 20th International Conference on Electronic Materials and Packaging 雑誌 1 ( 3 ) 2018.12
Highly Relaible (Pb, La)(Zr, Ti)O3 Ferroelectric Capacitor with Sputtered Sn-Doped In2O3 Electrode Reviewed
T. Saito, A. Kobayashi, Y. Takada, and N. Okamoto
2018 20th International Conference on Electronic Materials and Packaging 雑誌 1 ( 3 ) 2018.12
Synthesis of Iron Sulfide by using Electrodeposition Method and Discussion of the Influence of Solvent Reviewed
H. Tamura, N. Okamoto, and T. Saito
2018 20th International Conference on Electronic Materials and Packaging 雑誌 1 ( 4 ) 2018.12
First Principles Calculation of the Structure and Quantum Capacity of Acidic Functional Groups on Graphene-Based Capacitor’ B. Li, T. Reviewed
T. Saito, and N. Okamoto
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 539 ( 542 ) 2018.04
Synthesize of Negative Electrode Composed 3D Nano-Structures and Sn Based Material for Sodium Ion Secondary Battery Reviewed
N. Okamoto, K. Kikuchi, K. Morita, and T. Saito
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 234 ( 237 ) 2018.04
Thermal Conductivity Measurement of Diamond and β-Ga2O3Thin Films by a 3ω Method Reviewed
S. Suzuki, S. Ohmagari, Y. Akutsu, N. Okamoto, T. Saito, H. Umezawa, and Y. Mokuno
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 583 ( 584 ) 2018.04
Electrodeposition of ZnS and Evaluation of its Optical Property Reviewed
T. Saito, and N. Okamoto
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 566 ( 569 ) 2018.04
Fabrication and Electrical Properties of (Pb,La)(Zr,Ti)O3 Capacitor with Pulsed Laser Deposited Sn-Doped In2O3 Bottom Electrode on Al2O3 (0001) Reviewed
Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima
Japanese Journal of Applied Physics 雑誌 56 2017.07
Sulfide Semiconductor Materials Prepared by High-Speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism Reviewed
N. Okamoto* K. Kataoka T. Saito
Jpn. J. Appl. Phys 雑誌 応用物理学会 56 2017.07
Sn Negative Electrode Consists of Flexible 3D Structures for Sodium Ion Secondary Batteries Reviewed
N. Okamoto, K. Morita and T. Saito
ECS Trans. 雑誌 ECS 75 ( 22 ) 59 - 66 2017.06
Evaluation of Titanium Carbide Thin Film Coatings on WC-Co Following Surface Microstructure Treatments Reviewed
C. Tanaka, T. Saito, N. Okamoto, S. Suzuki, A. Kitajima and K. Higuchi
Materials and Corrosion 雑誌 68 ( 7 ) 711 - 716 2017.02
Comparative Study of Hydrogen- and Deuterium-Induced Degradation of Ferroelectric (Pb,La)(Zr,Ti)O3 Capacitors Using Time-of-Flight Secondary Ion Measurement
Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido
IEEE Trans. Ultrason. Ferroelectr. Freq. Control 雑誌 IEEE 63 ( 10 ) 1668 - 1673 2016.10
Sulfide Semiconductor Materials prepared by High-speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism
N. Okamoto, K. Kataoka and T. Saito
ADMETA PLUS 2016 Proc. 雑誌 IEEE 44 - 45 2016.10
電析法を用いた硫化物半導体の作製と電気化学測定による反応機構の考察 Reviewed
岡本尚樹, 片岡健太郎, 齊藤丈靖
第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 199 - 202 2016.09
電気化学的手法によるSn系Naイオン二次電池用負極材の作製 Reviewed
岡本尚樹, 守田昴輝, 齊藤丈靖
第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 195 - 198 2016.09
Comparative study of ferroelectric (K,Na)NbO3 thin films pulsed laser deposition on platinum substrates with different orientation’ Reviewed
R. Tamano, Y. Takada, N. Okamoto. T. Saito, K. Higuchi, A. Kitajima, T. Yoshimura, and N. Fujimura
Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌 1 - 4 2016.08
Evaluatioion of deuterium ion profile in (Pb,La)(Zr,Ti)O3 capacitors structures with conductive oxide top electrode by time of flight secondary ion mass spectrometry Reviewed
Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima and R. Shishido
Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌 1 - 4 2016.08
Fabrication of Doped Pb(Zr,Ti)O3 Capacitors on Pt Substrates with Different Orientations
R. Tamano, T. Amano, Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima.
Electronics Letters 雑誌 52 ( 16 ) 1399 - 1401 2016.07
Al: ZnO top electrodes deposited with various oxygen pressures for ferroelectric (Pb, La)(Zr,Ti)O3 capacitors Reviewed
Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima
Electronics Letters 雑誌 Electronics Letters 52 230 - 232 2016.05
Ferroelectric Properties of (Pb,La)(Zr,Ti)O3 Capacitors Employing Al-doped ZnO Top Electrodes Prepared by Pulsed Laser Deposition under Different Oxygen Ressures Reviewed
Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima
Japanese Journal of Applied Physics 雑誌 55 ( 6S3 ) 2016.05
Reliability of the properties of (Pb,La)(Zr,Ti)O3 capacitors with non–noble metal oxide electrodes stored in an H2 atmosphere
Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido
MRS Advances 雑誌 MRS 1 369 - 374 2016.01
Sn Negative Electrode Consists of Amorphous Structures for Lithium Ion and Sodium Ion Secondary Batteries Reviewed
N. Okamoto, K. Morita, T. Fujiyama, T. Saito and K. Kondo
MRS Advance 雑誌 MRS 1 409 - 414 2016.01
電気化学的手法によるSn系Liイオン二次電池用負極材の作製 Reviewed
岡本尚樹, 藤山貴友,中井那美, 岡田考史, 齊藤丈靖, 近藤和夫
第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 247 - 250 2015.09
電気化学的手法を用いた硫化物半導体粒子の作製 Reviewed
岡本尚樹, 片岡健太郎,神林 洸, 齊藤丈靖, 近藤和夫
第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 243 - 246 2015.09
Role of Cuprous Ion in Copper Electrodeposition Acceleration Reviewed
T. Hayashi, S. Matsuura, K. Kondo, K Kataoka, K. Nishimura, M. Yokoi, T. Saito and N. Okamoto
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS 162 ( 6 ) D199 - D203 2015.06
Effect of Al-doped ZnO or Sn-doped In2O3 electrode on ferroelectric properties of (Pb,La)(Zr,Ti)O-3 capacitors Reviewed
Y. Takada, T. Tsuji, N. Okamoto, T. Saito,K. Kondo, T. Yoshimura, N. Fujimura, N K. Higuchi, A. Kitajima and H. Iwai
JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP 54 ( 5S ) 83 - 87 2015.05
The orientation controlled (Pb,La)(Zr,Ti)O3 capacitor for improved reliabilities Reviewed
T. Saito, T. Amano, Y. Takada, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima
Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌 226 - 229 2015.05
Hydrogen profile measurement of (Pb,La)(Zr,Ti)O3 capacitor with conductive electrode after hydrogen annealing Reviewed
Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai, and R. Shishido
Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌 163 - 165 2015.05
Electrochemical study of multi-component additive behavior during copper electrodeposition with a microfluidic device and an electrochemical quartz crystal microbalance
T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo
JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP 54 ( 5S ) 2015.05
Effect of excess Pb on ferroelectric characteristics of conductive Al-doped ZnO and Sn-doped In2O3 top electrodes on PbLaZrTiOx capacitors Reviewed
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima
International Journal of Materials Research 雑誌 106 ( 1 ) 83 - 87 2015.01
The Effect of H2 Distribution in (Pb,La)(Zr,Ti)O3 Capacitors with Conductive Oxide Electrodes on the Degradation of Ferroelectric Properties Reviewed
Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai
Res. Soc. Symp. Proc. 雑誌 1729 93 - 98 2015.01
Five-Minute TSV Copper Electrodeposition Reviewed
K. Kondo, C. Funahashi, Y. Miyake, Y. Takeno, T. Hayashi , M. Yokoi, N. Okamoto and T. Saito
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS 161 ( 14 ) D791 - D793 2014.12
Improved reliability properties of (Pb,La) (Zr,Ti)O3 ferroelectric capacitors by thin aluminium-doped zinc oxide buffer layer Reviewed
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima
Electronics Letters 著書 50 ( 12 ) 799 - 800 2014.11
The Produced Cu+ Ionic Concentration Distribution Simulation inside the Via with PR Pulse Current Waveform Reviewed
T. Hayashi, M. Yokoi, N. Okamoto, T. Sait and K. Kondo
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS 161 ( 12 ) D681 - D686 2014.11
Electrochemical Study of the Multi-Component Additives Behavior during Copper Electrodeposition with a Microfluidic Device and an EQCM Reviewed
Y. Tsujimoto, Y. Miyamoto, N. Okamoto, T. Saito and K. Kondo
ADMETA plus 2014 Proc. 雑誌 IEEE 44 - 45 2014.10
Reduction of Thermal Expansion Coefficient of Electrodeposited Copper for TSV by Additive
K. Kondo, C. Funahashi, T. Hayashi, M. Yokoi, N. Okamoto and T. Saito
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 雑誌 IEEE 306 - 308 2014.10
ビア底部の1価銅イオン濃度とめっき電流密度の関係 Reviewed
林 太郎，濱崎公太，横井昌幸，岡本尚樹, 齊藤丈靖, 近藤和夫
第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 383 - 386 2014.09
銅めっきにおける一価銅と添加剤による析出反応への影響 Reviewed
西村光平，岡本尚樹, 齊藤丈靖，横井昌幸、近藤和夫
第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 379 - 382 2014.09
Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition Reviewed
M. Takeuchi, Y. Anami, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, M. Yokoi and K. Kondo
Electrochemistry 雑誌 82 ( 6 ) 430 - 437 2014.06
Adsorption behavior of poly(ethylene glycol) in the presence of two different kinds of halide ions, Br? and Cl? revealed using a microfluidic device and a flow cell type electrochemical quartz crystal microbalance Reviewed
Y. Tsujimoto, Y. Miyamoto, T. Saito, N. Okamoto, K. Kondo
Japanese Journal of Applied Physics 雑誌 JAP 53 ( 5 ) 2014.05
Aluminum-doped zinc oxide electrode for robust (Pb,La)(Zr,Ti)O3 capacitors - effect of oxide insulator encapsulation and oxide buffer layer - Reviewed
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima
Journal of Materials Science: Materials in Electronics 雑誌 25 ( 5 ) 2155 - 2161 2014.05
A Behavior of Cuprous Intermediate in Copper Damascene Electrodeposition Reviewed
K. Kondo, K. Hamazaki, M. Yokoi, N. Okamoto, T. Saito, T. Hayashi
ECS Electrochemistry Letters 雑誌 ECS 3 ( 4 ) D3 - D5 2014.03
電気Niめっきにおける添加剤を用いたトレンチフィリングによる構造物の作製
岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫
エレクトロニクス実装学会誌 雑誌 17 ( 2 ) 143 - 148 2014.03
微少流路型反応器を用いた異種ハロゲンイオン存在下におけるポリエチレングリコール吸着挙動の解析
辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫
第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 217 - 220 2013.09
PRパルスパラメータ制御によるビア内部のCu＋濃度分布とめっき形状の関係
林太郎, R. Akolkar, 横井昌幸, 岡本尚樹, 齊藤丈靖, 近藤和夫
第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 221 - 224 2013.09
銅穴埋めめっきにおけるジアリルアミン系レベラー側鎖の影響
山田康貴, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 横井昌幸, 近藤和夫
第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 213 - 216 2013.09
Comparative study of electrical properties of PbLaZrTiOx capacitors with Al-doped ZnO and ITO top electrodes
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima
Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE UFFC2013 - 001587 2013.07
Electrical properties of PbLaZrTiOx capacitors with conductive oxide buffer layer on Pt electrodes
T. Saito, Y. Takada, T. Tsuji, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima
Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE UFFC2013 - 002080 2013.07
Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform Reviewed
T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka, T. Tsuchiya
Journal of the Electrochemical Society 雑誌 160 ( 6 ) D256 - D259 2013.06
Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition
H. Masaoka, T. Saito, K. Kondo, N. Okamoto, T. Kan
ECS Transactions 雑誌 ECS 50 ( 46 ) 47 - 51 2013.06
The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes
N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo
ECS Transactions 雑誌 ECS 50 ( 32 ) 19 - 26 2013.06
Via filling electrodeposition of 4μm diameter via by periodical reverse current
T.Hayashi,K.Kondo,M.Takauchi,T.Saito,N.Okamoto, M. Bunya and M. Yokoi
ECS Transaction 雑誌 ECS 50 ( 32 ) 29 - 37 2013.06
Electrical properties of sol-gel derived PbLaZrTiOx capacitors with nonnoble metal oxide top electrodes
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Y. Fujimura, K. Higuchi, A. Kitajima, and A. Oshima
ECS Transactions 雑誌 ECS 50 ( 34 ) 43 - 48 2013.05
Small Diameter Via Filling Electrodeposition by Periodical Reverse Current Reviewed
T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka and T. Tsuchiya
ECTC2013 Proc. 雑誌 IEEE 1697 - 1702 2013.05
Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an Electrochemical Analysis with a Microfluidic Device and an Electrochemical Quartz Crystal Microbalance Reviewed
T. Saito, Y. Miyamoto, S. Hattori, N. Okamoto, K. Kondo
Japanese Journal of Applied Physics 雑誌 52 ( 5 ) 2013.05
Adsorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor
T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo
Int. Conf. on Electronics Packaging 2013 Proc. 雑誌 639 - 644 2013.04
Cu filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film Reviewed
N. Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto, M. Hirota
Electrochemica Acta 雑誌 82 2012.11
Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an EQCM and a Microfluidic Device Reviewed
T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo
Advanced Metallization Conference 2012: 22nd Asian Session Tokyo, Proc. 雑誌 2012.10
The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes Reviewed
N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo
ECS 222nd Meeting, Proc. 雑誌 ECS 2012.10
The Organic Additives Effects during Electroless Nickel and Silver Deposition on Carbon Nanotube Reviewed
T. Saito, Y. Takagi, N. Okamoto, K. Kondo, Y. Kobayashi, and Y. Fujiwara
ECS 222nd Meeting, Proc. 雑誌 ECS 2012.10
Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition Reviewed
H. Masaoka, S. Matsumoto, N. Okamoto, T. Saito, K. Kondo, and T. Kan
ECS 222nd Meeting, Proc. 雑誌 ECS 2012.10
Electrical Properties of Sol-gel Derived PbLaZrTiOx Capacitors with Nonnoble Metal Oxide Top Electrodes Reviewed
Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and A. Oshima
ECS 222nd Meeting, Proc. 雑誌 ECS 2012.10
急速液置換による銅めっき用有機添加剤の吸脱着挙動
辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫
第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 147 - 150 2012.09
めっき法を用いた偏光子の作製
岡本尚樹, 池田裕一, 小山義則, 齊藤丈靖, 近藤和夫, 河津泰幸
第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 157 - 158 2012.09
電気Niめっきを用いた構造物の作製
岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫
第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 155 - 156 2012.09
電解銅めっきにおけるPRパルス電流制御による直径4μmビア完全充填
林太郎, 竹内実, 齊藤丈靖, 岡本尚樹, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝
第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 153 - 154 2012.09
Two-dimensionally Patterned Electrodeposition of Sn Film from Aqueous Acid Bath Reviewed
T. Saito, K.Oshima, Y. Shimogaki, Y. Egashira, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi, H. Komiyama
Electrochemical Society Electrochem. Lett 雑誌 ECS 1 ( 2 ) D8 - D10 2012.07
Low Temperature Chemical Vapor Deposition of Silicon-rich Tungsten Silicide Films from Tungsten Hexafluoride-Disilane Pre-activated Mixtures Reviewed
T. Saito, K.Oshima, Y. Shimogaki, Y. Egashira, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi, H. Komiyama
International Journal of Chemical Reactor Engineering 雑誌 10 2012.07
Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device Reviewed
Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo
Japanese Journal of Applied Physics 雑誌 51 ( 5 ) 2012.05
Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm Electroplating
M.Takeuchi, K.Kondo, H.Kuri, M.Bunya, N.Okamoto, T.Saito
ECS Transaction 雑誌 ECS 41 ( 43 ) 2012.05
High Speed Copper Electrodeposition for Through Silicon Via(TSV) Reviewed
T. Hayashi, *K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka, T. Tsuchiya, M. Bunya
ECS Transactions 雑誌 41 ( 43 ) 45 - 51 2012.05
Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition Reviewed
K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito
J. Electrochem. Soc 雑誌 ECS 159 ( 4 ) 2012.04
微小流路型反応器を利用した銅めっき液中添加剤作用の解析
齊藤丈靖, 宮本 豊, 服部 直, 岡本 尚樹, 近藤和夫
信学技報 雑誌 111 SDM2011 - 181 2012.03
3D Interconnected Technology by High Speed Copper Electrodeposition using Diallylamine Levelers
T. Hayashi, K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka
3DIC, Proc 雑誌 2012.01
ジアリルアミン添加剤を用いた銅穴埋めめっき Reviewed
阿南善裕, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 近藤和夫
表面技術 雑誌 62 ( 12 ) 728 - 730 2011.12
High Speed Seamless Via Filling by Copper Electrodeposition
T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo
AEMAP2011, Proc. 雑誌 2011.12
High-speed through silicon via(TSV) Filling using Diallylamine additive Reviewed
T. Hayashi, K. Kondo, T. Saito, M. Takeuchi, and N. Okamoto
J. Electrochem. Soc 雑誌 ECS 158 ( 12 ) D715 - D718 2011.12
平滑な電解銅箔の作製における添加剤の影響 Reviewed
竹田依加, 岡本尚樹, 齊藤丈靖, 近藤和夫
化学工学論文集 雑誌 37 ( 6 ) 551 - 555 2011.11
急速液置換による銅めっき用有機系添加剤の吸脱着挙動解析
宮本豊, 服部直, 齊藤丈靖, 岡本尚樹, 近藤和夫
第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 61 - 64 2011.09
ジアリルアミン系レベラーを用いた銅穴埋めっき
阿南善裕, 岡本尚樹, 齊藤丈靖, 近藤和夫, 竹内実, 文屋勝
第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 141 - 144 2011.09
Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Aluminum Ion Additives Reviewed
T. Saito, , Y. Hirata, M. Oyanagi, N. Okamoto, K. Kondo
Mater. Lett. 雑誌 Elsevier 65 ( 17-18 ) 2826 - 2828 2011.09
Cu Filled Through-ｈole Electrode for ZnS Using High Adhesive Strength Ni-P Thin Film Reviewed
N. Okamoto, M. Miyamoto, Y. Niwa, T. Fukumoto, M. Hirota, T. Saito, K. Kondo
The 62nd Annual Meeting of the International Society of Electrochemistry, Proc. 雑誌 ECS 2011.09
Formation of electroless barrier and seed layers in a high aspect ratio through Si vias using Au nanoparticle catalyst for allwet Cu filling technology Reviewed
F. Inoue, T. Shimizu, T. Yokoyama, H. Miyake, K. Kondo,T. Saito, T. Hayashi, S. Tanaka, T. Terui, S. Shingubara
Electrochimica Acta 雑誌 56 ( 17 ) 6245 - 6250 2011.07
電解穴埋め銀めっきによるワイヤーグリッド偏光フイルムの作製 Reviewed
近藤和夫, 小山義則, 齊藤丈靖, 岡本尚樹
エレクトロニクス実装学会誌 雑誌 14 ( 7 ) 566 - 570 2011.07
Adosorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor
Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo
Int. Conf. on Electronics Packaging 2011 Proc. 雑誌 866 - 870 2011.04
Single dialylamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition
M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito
Int. Conf. on Electronics Packaging 2011 Proc. 雑誌 2011.04
Fabrication of Metal-Oxide-Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO2 and Al2O3 Reviewed
T. Saito, K.H. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada, Z.Q. Liu, K. Mitsuishi, K. Furuya and H. Okushi
Journal of Electronic Materials 雑誌 40 ( 3 ) 2011.03
Fabrication of Robust PbLa(Zr,Ti)O3 Capacitor Structures using Insulating Oxide Encapsulation Layers for FeRAM Integration Reviewed
T. Saito, T. Tsuji, K. Izumi, Y. Hirota, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, A. Kitajima and A. Oshima
Electronics Letters 雑誌 47 ( 1 ) 486 - 488 2011.01
Molecular Scale Growth of Electrolytic Copper Foils
K. Kondo, N. Okamoto, T. Saito and M. Takeuchi
ECS Transaction 雑誌 ECS 28 ( 29 ) 89 - 93 2010.10
銅穴埋めめっきにおけるジアリル系アミン添加剤の効果
久利英之,岡本尚樹,齊藤丈靖,近藤和夫,文屋 勝,竹内 実
第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 143 - 146 2010.09
平滑電解銅箔の作製と添加剤の影響
竹田依加,岡本尚樹,齊藤丈靖,近藤和夫
第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 127 - 130 2010.09
三次元実装のための流水路構造の数値解析
宮本 豊,齊藤丈靖,岡本尚樹,近藤和夫
第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 179 - 183 2010.09
High Adhesive Strength Ni–P Thin Film on ZnS by an Electroless Deposition Process Reviewed
N. Okamoto, M. Miyamoto, T. Sairto, K. Kondo. T. Fukumoto and T. hirota
Electrochemical and Solid-State Letters 雑誌 ECS 13 ( 6 ) J74 - J76 2010.06
High Speed Through Silicon Via Filling by Copper Electrodeposition Reviewed
K. Kondo, Y. Suzuki, T. Saito, N. Okamoto and M. Takeuchi
Electrochemical and Solid State Letters 雑誌 ECS 13 ( 5 ) D26 - D28 2010.05
High Speed Copper Electrodeposition for Through Silicon Via (TSV)
K. Kondo, Y. Suzuki, T. Saito and N. Okamoto
ECS Transaction 雑誌 ECS 25 ( 38 ) 127 - 131 2010.04
Improvement of Ferroelectric Properties by Non-noble-metal-oxide–electrode and Encapsulation Layer Reviewed
K. Izumi, T. Tsuji, Y. Hirota, T. Saito, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura
Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌 PS-57 113 - 114 2010.03
Deposition of Metal Oxide Thin Film in Supercritical Carbon Dioxide Reviewed
A. Kojima, Y. Hirota, N. Okamoto, T. Saito, K. Kondo, S. Takami
Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌 PS-58 115 - 116 2010.03
Shape Evolution of Electrodeposit Bumps with Shallow and Deep Cavities Reviewed
K. Kondo Y. Suzuki, T. Saito, N. Okamoto and Y. Koyama
J. Electrochem. Soc 雑誌 ECS 156 ( 12 ) D548 - D552 2009.12
Amorphous Carbon Film Deposition for Hydrogen Barrier in FeRAM Integration by Radio Frequency Plasma Chemical Vapor Deposition Method
T. Saito, K. Izumi, Y. Hirota, N. Okamoto and K Kondo
ECS Transaction 雑誌 ECS 25 ( 8 ) 693 2009.10
High-Aspect Ratio Copper-Via Filling for Three Dimensional Chip Stacking
K. Kondo, U. Suzuki, T. Saito, N. Okamoto and M. Marunaka
ECTC Proceedings 雑誌 ETCT 2009.05
A Rotating Ring Disk Electrode(RRDE) Study of Cuprous Thiolate Accelerant Produced by Copper Dissolution
S. Hattori, D. P.Barkey,K. Kondo,T. Saito and N. Okamoto
ICEP Proceedings 雑誌 ICEP 2009.04
Effect of New Levelers for Cu Via-filling
H. Kuri, N. Okamoto, T. Saito and K. Kondo
ICEP Proceedings 雑誌 ICEP 2009.04
Numerical Analysis of Transport Phenomena in High Aspect Cavity for Bump Formation
Y. Koyama, Y. Suzuki, N. Okamoto, T. Saito and K. Kondo
ICEP Proceedings 雑誌 ICEP 2009.04
Shape Evolution of Electrodeposited Bumps into Deep Cavity
K. Kondo, Y. Suzuki, N. Okamoto and T. Saito
ECS Transaction 雑誌 ECS 16 ( 22 ) 59 - 67 2009.02
Formation Factor of Nodule by Copper Electrodeposition
S. Takahashi, N. Okamoto, T. Saito and K. Kondo
ECS Transaction 雑誌 ECS 16 ( 22 ) 49 - 57 2009.02
CaBi4Ti4O15 thin film deposition on electroplated Platinum substrates using a sol-gel method Reviewed
T. Saito, Y. Hirota, M. Ooyanagi, N. Okamoto, K. Kondo
Mater. Res. Soc. Symp. Proc. 雑誌 MRS 1113E 2008.12
Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Cation Additives Reviewed
T. Saito, Y. Hirata, N. Okamoto and K. Kondo
Mater. Res. Soc. Symp. Proc. 雑誌 MRS 1113E 2008.12
Influence of the positive ions on ZnO thin film growth in aqueous solution
T. Saito, Y. Hirata, N. Okamoto and K. Kondo
Proc. of 2008 Korea-Japan Joint Workshop on Advanced Semiconductor Processes and Equipments 雑誌 269 - 273 2008.10
PR電解を用いた銅穴埋めめっき Reviewed
近藤和夫, 福田良, 齊藤丈靖, 岡本尚樹, 伊藤潔
表面技術 雑誌 表面技術協会 59 ( 9 ) 627 - 632 2008.09
トレンチ内へのニッケルめっき膜の作成 Reviewed
安宅一泰, 岡本尚樹, 齊藤丈靖, 近藤和夫
第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 163 - 166 2008.09
Ni-Co合金の微小構造物の作製 Reviewed
山田雅士, 岡本尚樹, 齊藤丈靖, 近藤和夫
第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会 159 - 162 2008.09
Kinetic Modeling of Tungsten Silicide Chemical Vapor Deposition from WF6 and Si2H6 : Determination of the reaction scheme and the gas-phase reaction rates Reviewed
T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata and S. Yamaguchi
Chemical Engineering Science 雑誌 Vol.62 2007.11
Leakage Current Analysis of Diamond Schottky Barrier Diode Reviewed
H. Umezawa, T. Saito, N. Tokuda, M. Ogura, S. G. Ri, H. Yoshikawa and S. Shikata
Applied Physics Letters 雑誌 Vol.90 2007.04
Surface Roughening of Diamond (001) Films during Homoepitaxial Growth in Heavy Boron Doping Reviewed
N. Tokuda, H. Umezawa, T. Saito, K. Yamabe, H. Okushi and S. Yamasaki
Diamond and Related Materials 雑誌 Vol.16 767 - 770 2007.04
The Role of Boron Atoms in Heavily Boron-doped Semiconducting Homoepitaxial Diamond Growth ? Study of Surface Morphology Reviewed
N. Tokuda, T. Saito, H. Umezawa, H. Okushi and S. Yamasaki
Diamond and Related Materials 雑誌 Vol.16 409 - 411 2007.03
Kinetics of Chemical Vapor Deposition of WSix Films from WF6 and SiH2Cl2: Effect of added H2, SiH4, and Si2H6 Reviewed
T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata and S. Yamaguchi
Microelectronic Engineering 雑誌 Vol. 83 2006.10
Kinetic study of Chemical Vapor Deposition of WSix films from WF6 and SiH2Cl2 : Determination of Molecular Size and Reactivity of Gas Species Reviewed
T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi
Thin Solid Films, 雑誌 ( 513 ) 36 - 42 2006.08
Electrical Properties of Diamond MISFETs with Submicron Gate on Boron-doped (111) Surface Reviewed
T. Saito, K. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada and H Okushi
Mater. Res. Soc. Symp. Proc. 雑誌 Vol.891 2006.03
Fabrication of Diamond MISFET with Micron-sized Gate Length on Boron-doped (111) Surface Reviewed
T. Saito, K. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada and H Okushi
Diamond and Related Materials 雑誌 Vol.14 2043 - 2046 2005.04
New Etching Process for Device Fabrication using Diamond Reviewed
D.S. Hwang, T. Saito and N. Fujimori
Diamond and Related Materials 雑誌 Vol.13 2207 - 2210 2004.04
New Multi Layer Top Electrode of SRO/IrOx for 0.35um FRAM Reviewed
Y. Horii, J. S. Cross, N. Sato, S. Ozawa, K. Matsuura, M. Fujiki, T. Saito, S. Mihara, T. Eshita, S. Sun, F. Chu, G. Fox, R. Bailey, T. Davenport and T. Yamazaki
Extended Abstracts of 2002 International Conference on Solid State Devices and Materials 雑誌 84 - 85 2002.08
Mass-Productive High Performance 0.5um Embedded FRAM Technology with Triple Layer Metal
A. Itoh, Y. Hikosaka, T. Saito, H. Naganuma, H. Miyazawa, Y. Ozaki, Y. Kato, S. Mihara, H. Iwamoto, S. Mochizuki, M. Nakamura and T. Yamazaki
Dig. Paper 2000 Symposium VLSI Technology 雑誌 32 - 33 2000.06
Surface Morphology and Electrical Properties of Boron-Doped Diamond Films Synthesized by Microwave-Assisted Chemical Vapor Deposition using Trimethylboron on diamond (100) Substrate Reviewed
T. Tsubota, T. Fukui, T. Saito, K. Kusakabe, S. Morooka and H. Maeda
Diamond and Related Materials 雑誌 Vol. 9 1362 - 1368 2000.04
Effect of Total Reaction Pressure on Electrical Properties of Boron Doped Homoepitaxial (100) Diamond Films Formed by Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron Reviewed
T. Tsubota, T. Fukui, M. Kameta, T. Saito, K. Kusakabe, S. Morooka, H. Maeda
Diamond and Related Materials 雑誌 8 1079 - 1082 1999.06
Incorporation of Butyl Groups on Diamond Surface by Reactions in Organic Solvents Reviewed
S. Morooka, S. Egawa, T. Tsubota, T. Saito, K. Kusakabe, H. Maeda
New Diamond and Frontier Carbon Technology 雑誌 9 1999.03
Synthesis and Electrical Properties of p-type Homoepitaxial (100) Diamond Films Formed by Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron Reviewed
T. Tsubota, T. Fukui, T. Saito, K. Kusakabe, S. Morooka, H. Maeda
New Diamond and Frontier Carbon Technology 雑誌 9 1999.03
Electrical Properties of Homoepitaxial Boron-Doped Diamond Thin Films Grown by Chemical Vapor Deposition using Trimethylboron Reviewed
S. Morooka, T. Fukui, K. Semoto, T. Tsubota, T. Saito, K. Kusakabe, H. Maeda, Y. Hayashi, T. Asano
Diamond and Related Materials 雑誌 8 42 - 47 1999.01
Epitaxial Nucleation of Diamond on Iridium Substrate by Bias Treatment in Microwave Plasma-Assisted Chemical Vapor Deposition Reviewed
T. Saito, S. Tsuruga, N. Ohya, K. Kusakabe, S. Morooka, H. Maeda, A. Sawabe, K. Suzuki
Diamond and Related Materials 雑誌 7 1381 - 1384 1998.09
Morphology and Semiconducting Properties of Homoepitaxially Grown Phosphorus-Doped (100) and (111) Diamond Films by Microwave Plasma-Assisted Chemical Vapor Deposition Using Triethylphosphine As a Dopant Source Reviewed
T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda, Y. Hayashi, T. Asano, A. Kawahara
Journal of Crystal Growth 雑誌 191 723 - 733 1998.08
Halogenation and Butylation of Diamond Surfaces by Reactions in Organic Solvents Reviewed
Y. Ikeda, T. Saito, K. Kusakabe, S. Morooka, H. Maeda, Y. Taniguchi, Y. Fujiwara
Diamond and Related Materials 雑誌 7 830 - 834 1998.06
Synthesis and Electrical Properties of Phosphorus-Doped Homoepitaxial Diamond (111) by Microwave Plasma-Assisted Chemical Vapor Deposition Using Triethylphosphine as a Dopant Source
T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda, Y. Hayashi, T. Asano
Japanese Journal of Applied Physics 雑誌 37 L543 - L546 1998.05
Incorporation of Butyl-Groups into Chlorinated Diamond Surface Carbons by Organic Reactions at Ambient Temperature Reviewed
T. Saito, Y. Ikeda, S. Egawa, K. Kusakabe, S. Morooka, H. Maeda, Y. Taniguchi, Y. Fujiwara
Journal of Chemical Society 雑誌 94 929 - 932 1998.04
Synthesis of Phosphorus-Doped Homoepitaxial Diamond with Triethylphosphine by Microwave Plasma-Assisted Chemical Vapor Deposition Reviewed
T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda
Diamond and Related Materials 雑誌 7 560 - 564 1998.02
Growth Behavior of Boron-Doped Diamond in Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron as the Dopant Source Reviewed
H. Maeda, K. Ohtsubo, M. Kameta, T. Saito, K. Kusakabe, S. Morooka, T. Asano
Diamond and Related Materials 雑誌 7 88 - 95 1998.01
Improvement of Diamond Nuclei Orientation by Double Step Bias Treatment in Microwave Plasma assisted Chemical Vapor Deposition using C2H4 as Carbon Source Reviewed
T. Saito, S. Tsuruga, H. Maeda, K. Kusakabe, S. Morooka
Diamond and Related Materials 雑誌 6 668 - 672 1997.04
Chemical Modification of Diamond Surfaces Reviewed
Y. Ikeda, T. Saito, H. Maeda, K. Kusakabe, S. Morooka, Y. Taniguchi, Y. Fujiwara
Theories and Applications of Chemical Engineering 雑誌 3 1223 - 1236 1997.02
Synthesis of Ultrafine Titanium Diboride Particles by Rapid Carbothermal Reduction in a Particulate Transport Reactor Reviewed
T. Saito, T. Fukuda, H. Maeda, K. Kusakabe, S. Morooka
ournal of Materials Science 雑誌 32 1997.01
Control of Selective Tungsten Chemical Vapor Deposition by Monolayer Nitridation of a Silicon Surface Reviewed
S. Takami, M. Fujii, T. Saito, Y. Egashira, H. Komiyama
Journal of the Electrochemical Society 雑誌 ECS 143 L38 - L40 1996.02
TiCl4/NH3を原料としたTiN薄膜CVD合成の反応機構 Reviewed
霜垣幸浩, 大久保頼聡, 齊藤丈靖, 江頭靖幸, 菅原活郎, 小宮山宏
電子情報通信学会技術研究報告 雑誌 Vol.95 ( No. 497 ) 1996.01
Kinetic Study of WSix-CVD Processes - A Comparison of WF6/SiH4 and WF6/Si2H6 Reaction Systems- Reviewed
T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi
Electronics and Communications in Japan 雑誌 Vol.78pt.2 1995.10
バイアス処理による高配向ダイヤモンドの核発生 Reviewed
前田英明, 丸井隆雄, 上野武夫, 齊藤丈靖, 草壁克己, 諸岡成治
日本結晶成長学会誌 雑誌 37 329 - 333 1995.09
WSix-CVDプロセスの反応機構 -WF6/SiH4, WF6/Si2H6反応系の比較- Reviewed
齊藤丈靖, 霜垣幸浩, 江頭靖幸, 小宮山宏, 菅原活郎, 高広克己, 永田晋二, 山口貞衛
電子情報通信学会論文誌C-II 雑誌 Vol.J78 1995.05
WF6/Si2H6によるWSixブランケットCVDのモデリングとシミュレーション Reviewed
江頭靖幸, 齊藤丈靖, 霜垣幸浩, 会田弘文, 小宮山宏, 菅原活郎
電子情報通信学会論文誌C-II 雑誌 Vol.J78 1995.05
WSix-CVDプロセスの反応機構 Reviewed
霜垣幸浩, 齊藤丈靖, 大久保頼聡, 福村昌已, 江頭靖幸, 小宮山宏, 菅原活郎
電子情報通信学会技術研究報告 雑誌 Vol.94 ( No. 469 ) 1995.01
Deposition of WSix Films from Preactivated Mixture of WF6/SiH4 Reviewed
T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama, S. Nagata, K. Takahiro, S. Yamaguchi
Japanese Journal of Applied Physics 雑誌 Vol.33 1994.01
Existence of Extinction Temperature in WSix Film Growth from WF6 and SiH4 - An Indication of the Role Plaed by Radical Chain Reactions - Reviewed
T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama, S. Nagata, K. Takahiro, S. Yamaguchi
Applied Physics Letters 雑誌 Vol.62 1993.04
The Conformal Deposition of WSix Films on Micron-sized Trenches - The Reactivity of Film Precursors as Species - Reviewed
T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama
Applied Physics Letters 雑誌 Vol.61 1992.08
The Reactivity and Molecular Size of Film Precursors during Chemical Vapor Deposition of Wsix Reviewed
Y. Shimogaki, T. Saito, F. Tadokoro and H. Komiyama
Journal de Physique IV, Colloque (France) 雑誌 Vol.1 ( No. C2 ) 1991.01
最新 実用真空技術総覧
秋山安信、齊藤丈靖、渡辺文雄 他（ Role： Joint author）
エヌ・ティ・エス 2019.02 （ ISBN:978-4-86043-559-2 ）
6. 社会との垣根を越える大学の挑戦 -大阪府 立大学21世紀科学 研究機構の活動と実績-
齊藤丈靖,岡本尚樹（分担執筆）（ Role： Joint author）
エヌ・ティ・エス 2011.12
改訂七版 化学工学便覧
三浦 孝一 他（ Role： Joint author）
丸善出版 2011.09
熱力学 －基礎と演習－
古南博,山下弘己,成澤雅紀,杉村博之,森口勇,森浩亮,田邉秀二,町田正人,齊藤丈靖（ Role： Joint author）
朝倉書店 2010.10
キセノンエキシマランプを使用したVUV-Redox法による銅表面の活性化
遠藤 真一・齊藤 丈靖
化学工学会第89年会 2024.03 化学工学会
還元性ガスを添加した反応性スパッタリングによるMAX合金薄膜の形成
齊藤 丈靖・上田 和貴・岡本 尚樹
化学工学会第89年会 2024.03 化学工学会
シランカップリング処理後の表面解析による無電解NiB膜の平滑化
山田 尚生・齊藤 丈靖・岡本 尚樹
化学工学会福井大会2023 2023.12 化学工学会関西支部
セルロース由来活性炭の収率向上とEDLC特性への含窒素有機系難燃剤の影響
Yiliya Aishan・齊藤 丈靖・武藤 明徳
化学工学会福井大会2023 2023.12 化学工学会関西支部
Preparation Conditions’ Impact on Melamine Pyrolysis and EDLC Electrodes International conference
7th International Conference on Advanced Capacitors (ICAC2023) 2023.09
Changes in Surface Functional Groups and Adhesion Strength to Heterogenous Material of UV Irradiated Epoxy-based Resin International conference
12th IEEE CPMT Symposium Japan (ICSJ2023) 2023.09
電析法で作製したZnSへの電気化学的Cuドーピングの検討
岡本 尚樹・松田 直大・齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
アルカリ水溶液中に分散したグラフェンに対する電気化学反応の考察
岡本 尚樹・ 三宅 怜・齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
Electrical Properties of Reactive Sputtered Ti or V - based MAX alloy Thin Films International conference
2023 International Conference on Solid State Devices and Materials 2023.09
UV処理したエポキシ系樹脂の表面官能基評価と異種界面の密着性
白樫陽菜，西浦拓海，齊藤丈靖，遠藤真一，石川有紀，岡本尚樹
第33回マイクロエレクトロニクスシンポジウム 2023.09
回折光学素子用金型製造プロセスにおけるNi電鋳の欠陥低減と剥離法の検討 Domestic conference
溝畑 凌生，岡本 尚樹，齊藤 丈靖，前田 有希
第33回マイクロエレクトロニクスシンポジウム 2023.09
銅めっきの均一電着性技術の向上
前川育穂，岡本尚樹，齊藤 丈靖，安田吉伸，亀村誠司
第33回マイクロエレクトロニクスシンポジウム 2023.09
金属ナノ粒子の肥料転用における有効性の検証
倉橋健介, 中村太郎,齊藤丈靖,中島壮一朗,岩崎哲史, 徳本勇人
日本植物学会大会第87回大会 2023.09
Electrical Properties of Reactive Sputtered Ti or V – based MAX alloy Thin Films International conference
K Ueda, T. Saito
2023 International Conference on Solid State Devices and Materials(SSDM2023) 2023.09 SSDM
金型製造プロセスにおけるNi電鋳の欠陥低減の検討 Domestic conference
溝畑 凌生，岡本 尚樹，齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
パルス電析法を用いたマグネシウム二次電池用Bi-Sn 負極材の評価 Domestic conference
岡田 和寛，岡本 尚樹，齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
パルス電析によるBi負極材の構造制御と充放電特性 Domestic conference
松本 周，岡本 尚樹，齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
細胞増殖を促進する酸化亜鉛ナノ粒子の粒径最適化技法の構築 Domestic conference
中島 壮一朗，清水 翔太，(阪公大高専) 倉橋 健介， (阪公大院理) 徳本 勇人，齊藤 丈靖
化学工学会第54回秋季大会 2023.09 化学工学会
反応性スパッタリングによるMAX合金薄膜形成と物性評価 Domestic conference
上田 和貴 ，若松 和伸 ，齊藤 丈靖 ， 岡本 尚樹
化学工学会第54回秋季大会 2023.09 化学工学会
Evaluation of Reactive Sputtered Ti-group MAX Alloy with Different A Elements for Wiring Material International conference
Takeyasu Saito,Kazunobu Wakamatsu,Kazuki Ueda, Naoki Okamoto
International Interconnect Technology Conference 2023 2023.05
乾式および湿式プロセスによる最先端半導体デバイス用極微細配線形成プロセスの現状 Domestic conference
齊藤丈靖
電気化学会第90 回大会 2023.03 電気化学会
Mg二次電池用Biアノードの析出形態制御と充放電特性 Domestic conference
松本周，成本夏輝，岡本尚樹，齊藤丈靖
化学工学会第53回秋季大会 2022.09 化学工学会
パルスめっきによるBi負極材の析出形態制御と充放電特性 Domestic conference
松本周，成本夏輝，岡本尚樹，齊藤丈靖
第32回マイクロエレクトロニクスシンポジウム（MES2022） 2022.09 エレクトロニクス実装学会
反応性スパッタリングによるTi系MAX合金薄膜の物性に及ぼすA元素の効果 Domestic conference
上田和貴，若松和伸，岡本尚樹，齊藤丈靖
第32回マイクロエレクトロニクスシンポジウム（MES2022） 2022.09 エレクトロニクス実装学会
反応性スパッタリングによるMAX化合物薄膜形成とM元素の効果 Domestic conference
若松和伸，上田和貴，岡本尚樹，齊藤丈靖
第32回マイクロエレクトロニクスシンポジウム（MES2022） 2022.09 エレクトロニクス実装学会
有機シラン処理を用いたSi02上の極薄無電解NiB膜の平滑化 Domestic conference
山田尚生，齊藤丈靖，岡本尚樹
第32回マイクロエレクトロニクスシンポジウム（MES2022） 2022.09 エレクトロニクス実装学会
Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material International conference
T. Saito, K. Wakamatsu, K. Ueda, N. Okamoto
2022 International Conference on Solid State Devices and Materials（SSDM2022） 2022.09 SSDM
Control of Surface Oxidation and Stress by Additives in Ni Electrodeposition International conference
T. Saito, K. Yamada, R. Komoda, N. Okamoto
2022 International Conference on Solid State Devices and Materials（SSDM2022） 2022.09 SSDM
反応性スパッタリングによるTi系およびV系MAX合金薄膜の物性に及ぼすA元素とX元素の効果 Domestic conference
齊藤丈靖
第37回エレクトロニクス実装学会講演大会 2022.03 エレクトロニクス実装学会
Improvement of Charge/Discharge Characteristics with Surface Structure Controlled Bismuth Anode Materials by Electrodeposition for Magnesium-Ion Batteries International conference
T. Saito, N. Narumoto and N. Okamoto
2021 MRS Fall Meeting 2021.12
Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition International conference
N. Okamoto, M. Rindo, N. Yamada and T. Saito
ADMETA plus 2021 2021.10
Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evaluation of its electrochemical property International conference
N. Okamoto, H. Tamura, T. Saito
2021 International Conference on Solid State Devices and Materials 2021.09
Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic propertelectrochemical and photocatalytic property International conference
N. Okamoto, N. Matsuda. T. Saito
2021 International Conference on Solid State Devices and Materials 2021.09 SSDM
Ni電析における添加剤による表面酸化と応力の制御 Domestic conference
山田 紘平，薦田 凌輔，岡本 尚樹，齊藤 丈靖
第31回マイクロエレクトロニクスシンポジウム 2021.09
反応性スパッタリングによるTi系MAX合金配線材料の物性評価’ Domestic conference
若松 和伸，上田 和貴，岡本 尚樹，齊藤 丈靖
第31回マイクロエレクトロニクスシンポジウム 2021.09
Si熱酸化膜上の表面修飾による極薄無電解NiB膜の物性制御 Domestic conference
岡本 尚樹，山田 尚生，林藤 壮史，齊藤 丈靖
第31回マイクロエレクトロニクスシンポジウム 2021.09
非水系および水系溶媒を用いた硫化鉄の電析による作製 Domestic conference
岡本尚樹，田村 遥，齊藤丈靖
表面技術協会第144回講演大会 2021.09
電析によるZnS の作製とCu ドーピングによる光学特性の制御’ Domestic conference
岡本尚樹，松田直大，齊藤丈靖
表面技術協会第144回講演大会 2021.09
Pulsed Laser Deposition of Ti-Based MAX Compounds for Next-Generation Wiring Technology International conference
K. Wakamatsu, T. Saito, and N. Okamoto
239th ECS Meeting 2021.05
Surface Structure Control and Charge/Discharge Characteristics of Bismuth Anode Materials By Electrodeposition for Magnesium-Ion Batteries International conference
N. Narumoto, N. Okamoto, and T. Saito
239th ECS Meeting 2021.05
Comparative Study of Sheet Resistance Stability of Electro-Deposited Ni/Co – Alloy Thin Films
•M. Rindo, N. Okamoto, T. Saito (Osaka Prefecture University), and A. Kitajima (The Institute of Scientific and Industrial Research Osaka University)
239th ECS Meeting 2021.05
Preparation of Furfural Resin-Based Active Carbon with Acid Treated Pore Surface Electric Double Layer Capacitor International conference
•K. Hokari, S. Shimizu, N. Okamoto, T. Saito (Osaka Prefecture University), I. Ide, M. Nishikawa, and Y. Onishi (LIGNYTE. CO., LTD.)
239th ECS Meeting 2021.05
Low Temperature Deposition of TiB-based Hard Coating Films by Pulsed DC Plasma CVD International conference
T. Saito
ICMCTF 2021 2021.04
Advanced Internship in Chemical Engineering
2021 Practical Training
College of Engineering Internship
2021 Practical Training
Advanced Materials Process Engineering
2021
English Reading for Chemical Engineers
2021
Introduction to Physical Chemistry
2021
Chemical Engineering Thermodynamics
2021
Selected Topics in Materials Process Engineering
2021
2023
Number of graduate students presentations：19