Updated on 2024/02/15

写真a

 
Saito Takeyasu
 
Organization
Graduate School of Engineering Division of Science and Engineering for Materials, Chemistry and Biology Professor
School of Engineering Department of Chemical Engineering
Title
Professor
Affiliation
Institute of Engineering

Position

  • Graduate School of Engineering Division of Science and Engineering for Materials, Chemistry and Biology 

    Professor  2022.04 - Now

  • School of Engineering Department of Chemical Engineering 

    Professor  2022.04 - Now

Degree

  • 博士(工学) ( Others )

Research Areas

  • Environmental Science/Agriculture Science / Environmental load reduction and remediation  / 環境技術・環境材料

  • Nanotechnology/Materials / Nano/micro-systems  / マイクロ・ナノデバイス

  • Nanotechnology/Materials / Thin film/surface and interfacial physical properties  / 薄膜・表面界面物性

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment  / 機能材料・デバイス

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electric and electronic materials

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment

  • Nanotechnology/Materials / Thin film/surface and interfacial physical properties

  • Nanotechnology/Materials / Inorganic materials and properties

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Chemical reaction and process system engineering

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Research Interests

  • 半導体プロセス工学 半導体デバイス 化学気相合成 化学反応速度論 半導体材料工学

Research subject summary

  • CVDによるエネルギーデバイス用材料の製膜と評価

  • CVDによるダイヤモンド薄膜の高品質化

  • CVDによるハードコーティング

  • ダイヤモンド用コンタクト材料

  • めっきにおける吸・脱着現象の解明

  • 半導体デバイス用配線材料のプロセス工学

  • ワイドバンドギャップ材料

  • 強誘電体材料

  • 材料プロセス工学

  • 化学気相成長(CVD)の反応工学

Professional Memberships

  • 鉄鋼協会

    2015.01 - Now   Domestic

  • IEEE(米国電気電子技術者協会)

    2013.07 - Now   Overseas

  • 電気化学会

    2010.10 - Now   Domestic

  • CVD研究会

    2010.10 - Now   Domestic

  • 表面技術協会

    2009.04 - Now   Domestic

  • エレクトロニクス実装学会

    2007.04 - Now   Domestic

  • ニューダイヤモンドフォーラム

    2005.04 - Now   Overseas

  • Materials Research Society(U.S.A)

    2005.04 - Now   Overseas

  • ニューダイヤモンドフォーラム

    1995.04 - Now   Domestic

  • 化学工学会

    1995.04 - 1998.03   Domestic

  • Materials Research Society(U.S.A)

    1995 - Now   Overseas

  • Electrochemical Scociety

    1995 - Now   Overseas

  • 電子情報通信学会

    1991.04 - 1995.03   Domestic

  • 応用物理学会

    1991.01 - Now   Domestic

  • 化学工学会

    1990.04 - 1995.03   Domestic

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Awards

  • 第13回貴金属に関わる研究助成金 シルバー賞

    2012.03   田中貴金属販売株式会社  

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    Country:Japan

  • 第12回貴金属に関わる研究助成金 MMS賞

    2011.03   田中貴金属販売株式会社  

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    Country:Japan

  • 第11回貴金属に関わる研究助成金 MMS賞

    2010.03   田中貴金属販売株式会社  

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    Country:Japan

  • 優秀発明賞

    2001.06   富士通株式会社  

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    Country:Japan

Papers

  • Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds

    151   2023.12( ISSN:00262714

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    Publishing type:Research paper (scientific journal)  

    DOI: 10.1016/j.microrel.2023.115233

  • Improvement of the heat resistance of a liquid mold compound by bismaleimide resin

    Yuki Ishikawa, Tomoya Takao, Takeyasu Saito

    Microelectronics Reliability   143   2023.04

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    International / domestic magazine:International journal  

  • Evaluation of Reactive Sputtered Ti-group MAX Alloy with Different A Elements for Wiring Material

    2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings   2023( ISBN:9798350310979

  • Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition

    N. Okamoto, H. Tamura and T. Saito

    Proc. ADMETA Plus 2021   A-21-P3   2022.10

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic property Reviewed

    N. Okamoto, N. Matsuda, T. Saito

    Proc. SSDM2021   C-6-03   2022.09

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evalua-tion of its electrochemical property Reviewed

    N. Okamoto, H. Tamura and T. Saito

    Proc. SSDM2021   C-6-04   2022.09

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Pulsed Laser Deposition of Ti-Based MAX Compounds for Next-Generation Wiring Technology Reviewed

    K. Wakamatsu, T. Saito and N. Okamoto

    Proc. 239th ECS Meeting   E02-0932   2022.05

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    Authorship:Corresponding author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Electrodeposition of ZnS and evaluation of its electrochemical property

    N. Okamoto, N. Matsuda and T. Saito

    J. J. Appl. Phys.   61 ( SC )   SC1075   2022.03

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    Authorship:Last author   Publishing type:Research paper (scientific journal)   International / domestic magazine:International journal  

  • Morphology Control and Charge/Discharge Characteristics of Bi Anode Materials by Pulsed Electrodeposition

    Proceedings of Microelectronics Symposium   32 ( 0 )   195 - 198   2022

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  • Effect of M elements in Reactive sputtered MAX alloy thin film

    Proceedings of Microelectronics Symposium   32 ( 0 )   235 - 238   2022

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  • Effect of A Elements of Reactive Sputtered Ti-based MAX Alloy Thin Films on Physical Properties

    Proceedings of Microelectronics Symposium   32 ( 0 )   67 - 70   2022

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  • Ultra-thin and Smooth Electroless NiB Films on Organosilane Treated SiO2

    Proceedings of Microelectronics Symposium   32 ( 0 )   55 - 58   2022

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  • Surface Structure Control and Charge/Dischage Characteristics of Bismathb Anode Materials by Electrodeposition for Magnesium-Ion Batteries Reviewed

    N. Narumoto, N. Okamoto and T. Saito

    Proc. 239th ECS Meeting   A06-0413   2021.05

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Comparative Study of Sheet Resistance Stability of Electro-Deposited Ni/Co – Alloy Thin Films

    M. Rindo, N. Okamoto, T. Saito and A. Kitajima

    Proc. 239th ECS Meeting   E02-0931   2021.05

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    Authorship:Corresponding author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Preparation of Furfural Resin-Based Active Carbon with Acid Treated Pore Surface Electric Double Layer Capacitor Reviewed

    K. Hokari, S. Shimizu, N. Okamoto, T. Saito I. Ide, M. Nishikawa and Y. Onishi

    Proc. 239th ECS Meeting   A03-0237   2021.05

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    Authorship:Corresponding author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Surface structure control and charge/discharge characteristics of bismuth anode materials by electrodeposition for magnesium-ion batteries

    Natsuki Narumoto, Naoki Okamoto, Takeyasu Saito

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS   2021.03( ISSN:0957-4522

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    Publishing type:Research paper (scientific journal)  

    Bismuth is considered one of the promising anode materials for the magnesium-ion secondary battery (MIB), but it has a short cycle life because of the sluggish diffusion of Mg2+ into the Bi anode and the slow interfacial charge transfer. In this study, we employed electrodeposition as a simple method to deposit the Bi thin films as an anode material for MIB and tried to control the surface structure of the films. In addition, we measured the deposition behavior while varying experimental parameters. The crystallographic structure, surface morphology, and electrochemical performance of the Bi anodes were evaluated by X-ray diffraction, scanning electron microscopy, and a charging/discharging control device, respectively. Then, the relationships between the physical properties and charging/discharging characteristics of the Bi anode were investigated. In particular, a Bi electrode with the thickness of 1.5 mu m deposited at a density of 10 mA/cm(2) showed good cycling capability; its capacity at the 50th cycle was 101 mAh/g.

    DOI: 10.1007/s10854-021-05656-5

  • 電析法によるビスマス負極材の表面構造制御と充放電特性 Reviewed

    成本夏輝,岡本尚樹,齊藤丈靖

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   59 - 62   2020.09

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    Kind of work:Joint Work  

  • 酸素アニールによるITO電極表面状態と(Pb,La)(Zr,Ti)O3キャパシタの劣化特性 Reviewed

    石田裕紀,岡本尚樹,齊藤丈靖,

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   209 - 212   2020.09

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    Kind of work:Joint Work  

  • 次世代ロジックデバイス配線に向けた無電解NiBめっき膜のバリア性能と電気特性評価 Reviewed

    林藤壮史,岡本尚樹,齊藤丈靖,北島彰

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   127 - 130   2020.09

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    Kind of work:Joint Work  

  • フラン樹脂由来活性炭への酸性表面官能基の導入と電気二重層キャパシタ特性 Reviewed

    清水翔太,帆苅奏,岡本尚樹,齊藤丈靖,井手勇,西川昌信,大西慶和

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   79 - 82   2020.09

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    Kind of work:Joint Work  

  • Structural Analysis of Furfural Resin-based Active Carbon to Control an Electric Double-layer Capacitor Reviewed

    K. HOKARI, S. SUZUKI, N. OKAMOTO, T. SAITO, I. IDE, M. NISHIKAWA, Y. ONISHI

    Electrochemistry 雑誌 The Electrochemical Society of Japan   88 ( 3 )   127 - 131   2020.04

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    Kind of work:Joint Work  

  • Suppression of Killer Defects in Diamond Vertical-Type Schottky Barrier Diodes’ A. Kobayashi

    S. Ohmagari, H. Umezawa, D. Takeuchi, T. Saito

    Jpn. J. Appl. Phys. 雑誌   59   2020

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    Kind of work:Joint Work  

  • Thermally stable heavily boron-doped diamond resistors fabricated via selective area growth by hot-filament chemical vapor deposition

    Shin-ichiro Suzuki, Shinya Ohmagari, Hiroyuki Kawashima, Takeyasu Saito, Hitoshi Umezawa, Daisuke Takeuchi

    THIN SOLID FILMS   680   81 - 84   2019.06( ISSN:0040-6090

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    Publishing type:Research paper (scientific journal)  

    Diamond has attracted considerable attention as a next-generation high-temperature and radiation-proof semiconductor material, which can be applied in extremely harsh environments, such as in space or nuclear energy industry. To realize intelligent systems with diamondbased integrated circuits, not only transistors but also passive components (e.g., resistors, capacitors, and inductors) are required. In this study, we prepared heavily boron-doped (p+) diamond resistors via selective area growth by hot-filament chemical vapor deposition. Finger-shaped p+ patterns of various sizes were fabricated. By designing the shape and film resistivity, we demonstrated that p+ resistance could be well controlled. A small temperature-dependence of the resistance was confirmed. This is a characteristic of heavily B-doped diamond possessing a low activation energy. The resistance remained unchanged under 500 kGy X-ray irradiation, confirming the radiation hardness. These results will support the development of radiation hardened diamond-based electrical components.

    DOI: 10.1016/j.tsf.2019.04.029

  • Highly Reliable (Pb,La)(Zr, Ti)O 3 Ferroelectric Capacitor with Sputtered Sn-Doped In 2 O 3 Electrode

    T. Saito, A. Kobayashi, Y. Takada, N. Okamoto

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   ( 8660850 )   2019

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    Kind of work:Joint Work  

  • ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed

    H. Kashima, N. Okamoto, T. Saito

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   ( 8660865 )   2019

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    Kind of work:Joint Work  

  • Synthesis of Iron Sulfide by Using Electrodeposition Method and Discussion of the Influence of Solvent

    H. Tamura, N. Okamoto, T. Saito

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   ( 8660938 )   2019

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    Kind of work:Joint Work  

  • Structural Analysis and Electric Double Layer Capacitor of Furfural Resin-Based Active Carbon with Different Particle Size Reviewed

    K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I.Ide, M. Nishikawa, Y. Onishi,

    Proc. of 2019 International Conference on Electronics Packaging (ICEP 2019) 雑誌   ( 8733546 )   441 - 443   2019

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    Kind of work:Joint Work  

  • Electrodeposition of Cu Doped ZnS and Evaluation of its Photocatalytic Property Reviewed

    N. Matsuda, T. Saito, N. Okamoto

    Proc. of 2019 International Conference on Electronics Packaging (ICEP) 雑誌   8733595   424 - 427   2019

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    Kind of work:Joint Work  

  • ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed

    H. Kashima, N. Okamoto, and T. Saito

    2018 20th International Conference on Electronic Materials and Packaging 雑誌   1 ( 3 )   2018.12

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    Kind of work:Joint Work  

  • Highly Relaible (Pb, La)(Zr, Ti)O3 Ferroelectric Capacitor with Sputtered Sn-Doped In2O3 Electrode Reviewed

    T. Saito, A. Kobayashi, Y. Takada, and N. Okamoto

    2018 20th International Conference on Electronic Materials and Packaging 雑誌   1 ( 3 )   2018.12

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    Kind of work:Joint Work  

  • Synthesis of Iron Sulfide by using Electrodeposition Method and Discussion of the Influence of Solvent Reviewed

    H. Tamura, N. Okamoto, and T. Saito

    2018 20th International Conference on Electronic Materials and Packaging 雑誌   1 ( 4 )   2018.12

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    Kind of work:Joint Work  

  • First Principles Calculation of the Structure and Quantum Capacity of Acidic Functional Groups on Graphene-Based Capacitor’ B. Li, T. Reviewed

    T. Saito, and N. Okamoto

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌   539 ( 542 )   2018.04

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    Kind of work:Joint Work  

  • Synthesize of Negative Electrode Composed 3D Nano-Structures and Sn Based Material for Sodium Ion Secondary Battery Reviewed

    N. Okamoto, K. Kikuchi, K. Morita, and T. Saito

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌   234 ( 237 )   2018.04

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    Kind of work:Joint Work  

  • Thermal Conductivity Measurement of Diamond and β-Ga2O3Thin Films by a 3ω Method Reviewed

    S. Suzuki, S. Ohmagari, Y. Akutsu, N. Okamoto, T. Saito, H. Umezawa, and Y. Mokuno

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌   583 ( 584 )   2018.04

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    Kind of work:Joint Work  

  • Electrodeposition of ZnS and Evaluation of its Optical Property Reviewed

    T. Saito, and N. Okamoto

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌   566 ( 569 )   2018.04

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    Kind of work:Joint Work  

  • Fabrication and Electrical Properties of (Pb,La)(Zr,Ti)O3 Capacitor with Pulsed Laser Deposited Sn-Doped In2O3 Bottom Electrode on Al2O3 (0001) Reviewed

    Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima

    Japanese Journal of Applied Physics 雑誌   56   2017.07

  • Sulfide Semiconductor Materials Prepared by High-Speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism Reviewed

    N. Okamoto* K. Kataoka T. Saito

    Jpn. J. Appl. Phys 雑誌 応用物理学会   56   2017.07

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    Kind of work:Joint Work  

  • Sn Negative Electrode Consists of Flexible 3D Structures for Sodium Ion Secondary Batteries Reviewed

    N. Okamoto, K. Morita and T. Saito

    ECS Trans. 雑誌 ECS   75 ( 22 )   59 - 66   2017.06

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    Kind of work:Joint Work  

  • Evaluation of Titanium Carbide Thin Film Coatings on WC-Co Following Surface Microstructure Treatments Reviewed

    C. Tanaka, T. Saito, N. Okamoto, S. Suzuki, A. Kitajima and K. Higuchi

    Materials and Corrosion 雑誌   68 ( 7 )   711 - 716   2017.02

  • Comparative Study of Hydrogen- and Deuterium-Induced Degradation of Ferroelectric (Pb,La)(Zr,Ti)O3 Capacitors Using Time-of-Flight Secondary Ion Measurement

    Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido

    IEEE Trans. Ultrason. Ferroelectr. Freq. Control 雑誌 IEEE   63 ( 10 )   1668 - 1673   2016.10

  • Sulfide Semiconductor Materials prepared by High-speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism

    N. Okamoto, K. Kataoka and T. Saito

    ADMETA PLUS 2016 Proc. 雑誌 IEEE   44 - 45   2016.10

  • 電析法を用いた硫化物半導体の作製と電気化学測定による反応機構の考察 Reviewed

    岡本尚樹, 片岡健太郎, 齊藤丈靖

    第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   199 - 202   2016.09

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    Kind of work:Joint Work  

  • 電気化学的手法によるSn系Naイオン二次電池用負極材の作製 Reviewed

    岡本尚樹, 守田昴輝, 齊藤丈靖

    第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   195 - 198   2016.09

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    Kind of work:Joint Work  

  • Comparative study of ferroelectric (K,Na)NbO3 thin films pulsed laser deposition on platinum substrates with different orientation’ Reviewed

    R. Tamano, Y. Takada, N. Okamoto. T. Saito, K. Higuchi, A. Kitajima, T. Yoshimura, and N. Fujimura

    Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌   1 - 4   2016.08

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    Kind of work:Joint Work  

  • Evaluatioion of deuterium ion profile in (Pb,La)(Zr,Ti)O3 capacitors structures with conductive oxide top electrode by time of flight secondary ion mass spectrometry Reviewed

    Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima and R. Shishido

    Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌   1 - 4   2016.08

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    Kind of work:Joint Work  

  • Fabrication of Doped Pb(Zr,Ti)O3 Capacitors on Pt Substrates with Different Orientations

    R. Tamano, T. Amano, Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima.

    Electronics Letters 雑誌   52 ( 16 )   1399 - 1401   2016.07

  • Al: ZnO top electrodes deposited with various oxygen pressures for ferroelectric (Pb, La)(Zr,Ti)O3 capacitors Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima

    Electronics Letters 雑誌 Electronics Letters   52   230 - 232   2016.05

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    Kind of work:Joint Work  

  • Ferroelectric Properties of (Pb,La)(Zr,Ti)O3 Capacitors Employing Al-doped ZnO Top Electrodes Prepared by Pulsed Laser Deposition under Different Oxygen Ressures Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima

    Japanese Journal of Applied Physics 雑誌   55 ( 6S3 )   2016.05

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    Kind of work:Joint Work  

  • Reliability of the properties of (Pb,La)(Zr,Ti)O3 capacitors with non–noble metal oxide electrodes stored in an H2 atmosphere

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido

    MRS Advances 雑誌 MRS   1   369 - 374   2016.01

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    Kind of work:Joint Work  

  • Sn Negative Electrode Consists of Amorphous Structures for Lithium Ion and Sodium Ion Secondary Batteries Reviewed

    N. Okamoto, K. Morita, T. Fujiyama, T. Saito and K. Kondo

    MRS Advance 雑誌 MRS   1   409 - 414   2016.01

  • 電気化学的手法によるSn系Liイオン二次電池用負極材の作製 Reviewed

    岡本尚樹, 藤山貴友,中井那美, 岡田考史, 齊藤丈靖, 近藤和夫

    第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   247 - 250   2015.09

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    Kind of work:Joint Work  

  • 電気化学的手法を用いた硫化物半導体粒子の作製 Reviewed

    岡本尚樹, 片岡健太郎,神林 洸, 齊藤丈靖, 近藤和夫

    第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   243 - 246   2015.09

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    Kind of work:Joint Work  

  • Role of Cuprous Ion in Copper Electrodeposition Acceleration Reviewed

    T. Hayashi, S. Matsuura, K. Kondo, K Kataoka, K. Nishimura, M. Yokoi, T. Saito and N. Okamoto

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   162 ( 6 )   D199 - D203   2015.06

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    Kind of work:Joint Work  

  • Effect of Al-doped ZnO or Sn-doped In2O3 electrode on ferroelectric properties of (Pb,La)(Zr,Ti)O-3 capacitors Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito,K. Kondo, T. Yoshimura, N. Fujimura, N K. Higuchi, A. Kitajima and H. Iwai

    JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP   54 ( 5S )   83 - 87   2015.05

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    Kind of work:Joint Work  

  • The orientation controlled (Pb,La)(Zr,Ti)O3 capacitor for improved reliabilities Reviewed

    T. Saito, T. Amano, Y. Takada, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima

    Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌   226 - 229   2015.05

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    Kind of work:Joint Work  

  • Hydrogen profile measurement of (Pb,La)(Zr,Ti)O3 capacitor with conductive electrode after hydrogen annealing Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai, and R. Shishido

    Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌   163 - 165   2015.05

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    Kind of work:Joint Work  

  • Electrochemical study of multi-component additive behavior during copper electrodeposition with a microfluidic device and an electrochemical quartz crystal microbalance

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP   54 ( 5S )   2015.05

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    Kind of work:Joint Work  

  • Effect of excess Pb on ferroelectric characteristics of conductive Al-doped ZnO and Sn-doped In2O3 top electrodes on PbLaZrTiOx capacitors Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima

    International Journal of Materials Research 雑誌   106 ( 1 )   83 - 87   2015.01

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  • The Effect of H2 Distribution in (Pb,La)(Zr,Ti)O3 Capacitors with Conductive Oxide Electrodes on the Degradation of Ferroelectric Properties Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai

    Res. Soc. Symp. Proc. 雑誌   1729   93 - 98   2015.01

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  • Five-Minute TSV Copper Electrodeposition Reviewed

    K. Kondo, C. Funahashi, Y. Miyake, Y. Takeno, T. Hayashi , M. Yokoi, N. Okamoto and T. Saito

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   161 ( 14 )   D791 - D793   2014.12

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  • Improved reliability properties of (Pb,La) (Zr,Ti)O3 ferroelectric capacitors by thin aluminium-doped zinc oxide buffer layer Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima

    Electronics Letters 著書   50 ( 12 )   799 - 800   2014.11

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  • The Produced Cu+ Ionic Concentration Distribution Simulation inside the Via with PR Pulse Current Waveform Reviewed

    T. Hayashi, M. Yokoi, N. Okamoto, T. Sait and K. Kondo

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   161 ( 12 )   D681 - D686   2014.11

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  • Electrochemical Study of the Multi-Component Additives Behavior during Copper Electrodeposition with a Microfluidic Device and an EQCM Reviewed

    Y. Tsujimoto, Y. Miyamoto, N. Okamoto, T. Saito and K. Kondo

    ADMETA plus 2014 Proc. 雑誌 IEEE   44 - 45   2014.10

  • Reduction of Thermal Expansion Coefficient of Electrodeposited Copper for TSV by Additive

    K. Kondo, C. Funahashi, T. Hayashi, M. Yokoi, N. Okamoto and T. Saito

    2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 雑誌 IEEE   306 - 308   2014.10

  • ビア底部の1価銅イオン濃度とめっき電流密度の関係 Reviewed

    林 太郎,濱崎公太,横井昌幸,岡本尚樹, 齊藤丈靖, 近藤和夫

    第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   383 - 386   2014.09

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  • 銅めっきにおける一価銅と添加剤による析出反応への影響 Reviewed

    西村光平,岡本尚樹, 齊藤丈靖,横井昌幸、近藤和夫

    第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   379 - 382   2014.09

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  • Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition Reviewed

    M. Takeuchi, Y. Anami, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, M. Yokoi and K. Kondo

    Electrochemistry 雑誌   82 ( 6 )   430 - 437   2014.06

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  • Adsorption behavior of poly(ethylene glycol) in the presence of two different kinds of halide ions, Br? and Cl? revealed using a microfluidic device and a flow cell type electrochemical quartz crystal microbalance Reviewed

    Y. Tsujimoto, Y. Miyamoto, T. Saito, N. Okamoto, K. Kondo

    Japanese Journal of Applied Physics 雑誌 JAP   53 ( 5 )   2014.05

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  • Aluminum-doped zinc oxide electrode for robust (Pb,La)(Zr,Ti)O3 capacitors - effect of oxide insulator encapsulation and oxide buffer layer - Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Journal of Materials Science: Materials in Electronics 雑誌   25 ( 5 )   2155 - 2161   2014.05

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  • 電気Niめっきにおける添加剤を用いたトレンチフィリングによる構造物の作製

    岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫

    エレクトロニクス実装学会誌 雑誌   17 ( 2 )   143 - 148   2014.03

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  • A Behavior of Cuprous Intermediate in Copper Damascene Electrodeposition Reviewed

    K. Kondo, K. Hamazaki, M. Yokoi, N. Okamoto, T. Saito, T. Hayashi

    ECS Electrochemistry Letters 雑誌 ECS   3 ( 4 )   D3 - D5   2014.03

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  • 微少流路型反応器を用いた異種ハロゲンイオン存在下におけるポリエチレングリコール吸着挙動の解析

    辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   217 - 220   2013.09

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  • PRパルスパラメータ制御によるビア内部のCu+濃度分布とめっき形状の関係

    林太郎, R. Akolkar, 横井昌幸, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   221 - 224   2013.09

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  • 銅穴埋めめっきにおけるジアリルアミン系レベラー側鎖の影響

    山田康貴, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 横井昌幸, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   213 - 216   2013.09

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  • Comparative study of electrical properties of PbLaZrTiOx capacitors with Al-doped ZnO and ITO top electrodes

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE   UFFC2013 - 001587   2013.07

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  • Electrical properties of PbLaZrTiOx capacitors with conductive oxide buffer layer on Pt electrodes

    T. Saito, Y. Takada, T. Tsuji, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE   UFFC2013 - 002080   2013.07

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  • Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform Reviewed

    T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka, T. Tsuchiya

    Journal of the Electrochemical Society 雑誌   160 ( 6 )   D256 - D259   2013.06

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  • Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition

    H. Masaoka, T. Saito, K. Kondo, N. Okamoto, T. Kan

    ECS Transactions 雑誌 ECS   50 ( 46 )   47 - 51   2013.06

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  • The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes

    N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo

    ECS Transactions 雑誌 ECS   50 ( 32 )   19 - 26   2013.06

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  • Via filling electrodeposition of 4μm diameter via by periodical reverse current

    T.Hayashi,K.Kondo,M.Takauchi,T.Saito,N.Okamoto, M. Bunya and M. Yokoi

    ECS Transaction 雑誌 ECS   50 ( 32 )   29 - 37   2013.06

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  • Electrical properties of sol-gel derived PbLaZrTiOx capacitors with nonnoble metal oxide top electrodes

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Y. Fujimura, K. Higuchi, A. Kitajima, and A. Oshima

    ECS Transactions 雑誌 ECS   50 ( 34 )   43 - 48   2013.05

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  • Small Diameter Via Filling Electrodeposition by Periodical Reverse Current Reviewed

    T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka and T. Tsuchiya

    ECTC2013 Proc. 雑誌 IEEE   1697 - 1702   2013.05

  • Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an Electrochemical Analysis with a Microfluidic Device and an Electrochemical Quartz Crystal Microbalance Reviewed

    T. Saito, Y. Miyamoto, S. Hattori, N. Okamoto, K. Kondo

    Japanese Journal of Applied Physics 雑誌   52 ( 5 )   2013.05

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  • Adsorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    Int. Conf. on Electronics Packaging 2013 Proc. 雑誌   639 - 644   2013.04

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  • Cu filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film Reviewed

    N. Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto, M. Hirota

    Electrochemica Acta 雑誌   82   2012.11

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  • Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an EQCM and a Microfluidic Device Reviewed

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    Advanced Metallization Conference 2012: 22nd Asian Session Tokyo, Proc. 雑誌   2012.10

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  • The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes Reviewed

    N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • The Organic Additives Effects during Electroless Nickel and Silver Deposition on Carbon Nanotube Reviewed

    T. Saito, Y. Takagi, N. Okamoto, K. Kondo, Y. Kobayashi, and Y. Fujiwara

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition Reviewed

    H. Masaoka, S. Matsumoto, N. Okamoto, T. Saito, K. Kondo, and T. Kan

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • Electrical Properties of Sol-gel Derived PbLaZrTiOx Capacitors with Nonnoble Metal Oxide Top Electrodes Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and A. Oshima

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • 急速液置換による銅めっき用有機添加剤の吸脱着挙動

    辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   147 - 150   2012.09

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  • めっき法を用いた偏光子の作製

    岡本尚樹, 池田裕一, 小山義則, 齊藤丈靖, 近藤和夫, 河津泰幸

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   157 - 158   2012.09

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  • 電気Niめっきを用いた構造物の作製

    岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   155 - 156   2012.09

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  • 電解銅めっきにおけるPRパルス電流制御による直径4μmビア完全充填

    林太郎, 竹内実, 齊藤丈靖, 岡本尚樹, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   153 - 154   2012.09

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  • Two-dimensionally Patterned Electrodeposition of Sn Film from Aqueous Acid Bath Reviewed

    T. Saito, K.Oshima, Y. Shimogaki, Y. Egashira, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi, H. Komiyama

    Electrochemical Society Electrochem. Lett 雑誌 ECS   1 ( 2 )   D8 - D10   2012.07

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  • Low Temperature Chemical Vapor Deposition of Silicon-rich Tungsten Silicide Films from Tungsten Hexafluoride-Disilane Pre-activated Mixtures Reviewed

    T. Saito, K.Oshima, Y. Shimogaki, Y. Egashira, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi, H. Komiyama

    International Journal of Chemical Reactor Engineering 雑誌   10   2012.07

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  • Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device Reviewed

    Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo

    Japanese Journal of Applied Physics 雑誌   51 ( 5 )   2012.05

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  • High Speed Copper Electrodeposition for Through Silicon Via(TSV) Reviewed

    T. Hayashi, *K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka, T. Tsuchiya, M. Bunya

    ECS Transactions 雑誌   41 ( 43 )   45 - 51   2012.05

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  • Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm Electroplating

    M.Takeuchi, K.Kondo, H.Kuri, M.Bunya, N.Okamoto, T.Saito

    ECS Transaction 雑誌 ECS   41 ( 43 )   2012.05

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  • Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition Reviewed

    K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito

    J. Electrochem. Soc 雑誌 ECS   159 ( 4 )   2012.04

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  • 微小流路型反応器を利用した銅めっき液中添加剤作用の解析

    齊藤丈靖, 宮本 豊, 服部 直, 岡本 尚樹, 近藤和夫

    信学技報 雑誌   111   SDM2011 - 181   2012.03

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  • 3D Interconnected Technology by High Speed Copper Electrodeposition using Diallylamine Levelers

    T. Hayashi, K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka

    3DIC, Proc 雑誌   2012.01

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  • High-speed through silicon via(TSV) Filling using Diallylamine additive Reviewed

    T. Hayashi, K. Kondo, T. Saito, M. Takeuchi, and N. Okamoto

    J. Electrochem. Soc 雑誌 ECS   158 ( 12 )   D715 - D718   2011.12

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  • ジアリルアミン添加剤を用いた銅穴埋めめっき Reviewed

    阿南善裕, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 近藤和夫

    表面技術 雑誌   62 ( 12 )   728 - 730   2011.12

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  • High Speed Seamless Via Filling by Copper Electrodeposition

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    AEMAP2011, Proc. 雑誌   2011.12

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  • 平滑な電解銅箔の作製における添加剤の影響 Reviewed

    竹田依加, 岡本尚樹, 齊藤丈靖, 近藤和夫

    化学工学論文集 雑誌   37 ( 6 )   551 - 555   2011.11

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  • Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Aluminum Ion Additives Reviewed

    T. Saito, , Y. Hirata, M. Oyanagi, N. Okamoto, K. Kondo

    Mater. Lett. 雑誌 Elsevier   65 ( 17-18 )   2826 - 2828   2011.09

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  • Cu Filled Through-hole Electrode for ZnS Using High Adhesive Strength Ni-P Thin Film Reviewed

    N. Okamoto, M. Miyamoto, Y. Niwa, T. Fukumoto, M. Hirota, T. Saito, K. Kondo

    The 62nd Annual Meeting of the International Society of Electrochemistry, Proc. 雑誌 ECS   2011.09

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  • 急速液置換による銅めっき用有機系添加剤の吸脱着挙動解析

    宮本豊, 服部直, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   61 - 64   2011.09

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  • ジアリルアミン系レベラーを用いた銅穴埋めっき

    阿南善裕, 岡本尚樹, 齊藤丈靖, 近藤和夫, 竹内実, 文屋勝

    第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   141 - 144   2011.09

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  • Formation of electroless barrier and seed layers in a high aspect ratio through Si vias using Au nanoparticle catalyst for allwet Cu filling technology Reviewed

    F. Inoue, T. Shimizu, T. Yokoyama, H. Miyake, K. Kondo,T. Saito, T. Hayashi, S. Tanaka, T. Terui, S. Shingubara

    Electrochimica Acta 雑誌   56 ( 17 )   6245 - 6250   2011.07

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  • 電解穴埋め銀めっきによるワイヤーグリッド偏光フイルムの作製 Reviewed

    近藤和夫, 小山義則, 齊藤丈靖, 岡本尚樹

    エレクトロニクス実装学会誌 雑誌   14 ( 7 )   566 - 570   2011.07

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  • Adosorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor

    Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo

    Int. Conf. on Electronics Packaging 2011 Proc. 雑誌   866 - 870   2011.04

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  • Single dialylamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition

    M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito

    Int. Conf. on Electronics Packaging 2011 Proc. 雑誌   2011.04

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  • Fabrication of Metal-Oxide-Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO2 and Al2O3 Reviewed

    T. Saito, K.H. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada, Z.Q. Liu, K. Mitsuishi, K. Furuya and H. Okushi

    Journal of Electronic Materials 雑誌   40 ( 3 )   2011.03

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  • Fabrication of Robust PbLa(Zr,Ti)O3 Capacitor Structures using Insulating Oxide Encapsulation Layers for FeRAM Integration Reviewed

    T. Saito, T. Tsuji, K. Izumi, Y. Hirota, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, A. Kitajima and A. Oshima

    Electronics Letters 雑誌   47 ( 1 )   486 - 488   2011.01

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  • Molecular Scale Growth of Electrolytic Copper Foils

    K. Kondo, N. Okamoto, T. Saito and M. Takeuchi

    ECS Transaction 雑誌 ECS   28 ( 29 )   89 - 93   2010.10

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  • 三次元実装のための流水路構造の数値解析

    宮本 豊,齊藤丈靖,岡本尚樹,近藤和夫

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   179 - 183   2010.09

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  • 銅穴埋めめっきにおけるジアリル系アミン添加剤の効果

    久利英之,岡本尚樹,齊藤丈靖,近藤和夫,文屋 勝,竹内 実

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   143 - 146   2010.09

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  • 平滑電解銅箔の作製と添加剤の影響

    竹田依加,岡本尚樹,齊藤丈靖,近藤和夫

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   127 - 130   2010.09

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  • High Adhesive Strength Ni–P Thin Film on ZnS by an Electroless Deposition Process Reviewed

    N. Okamoto, M. Miyamoto, T. Sairto, K. Kondo. T. Fukumoto and T. hirota

    Electrochemical and Solid-State Letters 雑誌 ECS   13 ( 6 )   J74 - J76   2010.06

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  • High Speed Through Silicon Via Filling by Copper Electrodeposition Reviewed

    K. Kondo, Y. Suzuki, T. Saito, N. Okamoto and M. Takeuchi

    Electrochemical and Solid State Letters 雑誌 ECS   13 ( 5 )   D26 - D28   2010.05

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  • High Speed Copper Electrodeposition for Through Silicon Via (TSV)

    K. Kondo, Y. Suzuki, T. Saito and N. Okamoto

    ECS Transaction 雑誌 ECS   25 ( 38 )   127 - 131   2010.04

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  • Improvement of Ferroelectric Properties by Non-noble-metal-oxide–electrode and Encapsulation Layer Reviewed

    K. Izumi, T. Tsuji, Y. Hirota, T. Saito, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura

    Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌   PS-57   113 - 114   2010.03

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  • Deposition of Metal Oxide Thin Film in Supercritical Carbon Dioxide Reviewed

    A. Kojima, Y. Hirota, N. Okamoto, T. Saito, K. Kondo, S. Takami

    Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌   PS-58   115 - 116   2010.03

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  • Shape Evolution of Electrodeposit Bumps with Shallow and Deep Cavities Reviewed

    K. Kondo Y. Suzuki, T. Saito, N. Okamoto and Y. Koyama

    J. Electrochem. Soc 雑誌 ECS   156 ( 12 )   D548 - D552   2009.12

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    Kind of work:Joint Work  

  • Amorphous Carbon Film Deposition for Hydrogen Barrier in FeRAM Integration by Radio Frequency Plasma Chemical Vapor Deposition Method

    T. Saito, K. Izumi, Y. Hirota, N. Okamoto and K Kondo

    ECS Transaction 雑誌 ECS   25 ( 8 )   693   2009.10

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    Kind of work:Joint Work  

  • High-Aspect Ratio Copper-Via Filling for Three Dimensional Chip Stacking

    K. Kondo, U. Suzuki, T. Saito, N. Okamoto and M. Marunaka

    ECTC Proceedings 雑誌 ETCT   2009.05

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    Kind of work:Joint Work  

  • Numerical Analysis of Transport Phenomena in High Aspect Cavity for Bump Formation

    Y. Koyama, Y. Suzuki, N. Okamoto, T. Saito and K. Kondo

    ICEP Proceedings 雑誌 ICEP   2009.04

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    Kind of work:Joint Work  

  • A Rotating Ring Disk Electrode(RRDE) Study of Cuprous Thiolate Accelerant Produced by Copper Dissolution

    S. Hattori, D. P.Barkey,K. Kondo,T. Saito and N. Okamoto

    ICEP Proceedings 雑誌 ICEP   2009.04

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    Kind of work:Joint Work  

  • Effect of New Levelers for Cu Via-filling

    H. Kuri, N. Okamoto, T. Saito and K. Kondo

    ICEP Proceedings 雑誌 ICEP   2009.04

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  • Formation Factor of Nodule by Copper Electrodeposition

    S. Takahashi, N. Okamoto, T. Saito and K. Kondo

    ECS Transaction 雑誌 ECS   16 ( 22 )   49 - 57   2009.02

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    Kind of work:Joint Work  

  • Shape Evolution of Electrodeposited Bumps into Deep Cavity

    K. Kondo, Y. Suzuki, N. Okamoto and T. Saito

    ECS Transaction 雑誌 ECS   16 ( 22 )   59 - 67   2009.02

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    Kind of work:Joint Work  

  • CaBi4Ti4O15 thin film deposition on electroplated Platinum substrates using a sol-gel method Reviewed

    T. Saito, Y. Hirota, M. Ooyanagi, N. Okamoto, K. Kondo

    Mater. Res. Soc. Symp. Proc. 雑誌 MRS   1113E   2008.12

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    Kind of work:Joint Work  

  • Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Cation Additives Reviewed

    T. Saito, Y. Hirata, N. Okamoto and K. Kondo

    Mater. Res. Soc. Symp. Proc. 雑誌 MRS   1113E   2008.12

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    Kind of work:Joint Work  

  • Influence of the positive ions on ZnO thin film growth in aqueous solution

    T. Saito, Y. Hirata, N. Okamoto and K. Kondo

    Proc. of 2008 Korea-Japan Joint Workshop on Advanced Semiconductor Processes and Equipments 雑誌   269 - 273   2008.10

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    Kind of work:Joint Work  

  • PR電解を用いた銅穴埋めめっき Reviewed

    近藤和夫, 福田良, 齊藤丈靖, 岡本尚樹, 伊藤潔

    表面技術 雑誌 表面技術協会   59 ( 9 )   627 - 632   2008.09

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    Kind of work:Joint Work  

  • Ni-Co合金の微小構造物の作製 Reviewed

    山田雅士, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   159 - 162   2008.09

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    Kind of work:Joint Work  

  • トレンチ内へのニッケルめっき膜の作成 Reviewed

    安宅一泰, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   163 - 166   2008.09

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    Kind of work:Joint Work  

  • Kinetic Modeling of Tungsten Silicide Chemical Vapor Deposition from WF6 and Si2H6 : Determination of the reaction scheme and the gas-phase reaction rates Reviewed

    T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata and S. Yamaguchi

    Chemical Engineering Science 雑誌   Vol.62   2007.11

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    Kind of work:Joint Work  

  • Surface Roughening of Diamond (001) Films during Homoepitaxial Growth in Heavy Boron Doping Reviewed

    N. Tokuda, H. Umezawa, T. Saito, K. Yamabe, H. Okushi and S. Yamasaki

    Diamond and Related Materials 雑誌   Vol.16   767 - 770   2007.04

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    Kind of work:Joint Work  

  • Leakage Current Analysis of Diamond Schottky Barrier Diode Reviewed

    H. Umezawa, T. Saito, N. Tokuda, M. Ogura, S. G. Ri, H. Yoshikawa and S. Shikata

    Applied Physics Letters 雑誌   Vol.90   2007.04

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    Kind of work:Joint Work  

  • The Role of Boron Atoms in Heavily Boron-doped Semiconducting Homoepitaxial Diamond Growth ? Study of Surface Morphology Reviewed

    N. Tokuda, T. Saito, H. Umezawa, H. Okushi and S. Yamasaki

    Diamond and Related Materials 雑誌   Vol.16   409 - 411   2007.03

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    Kind of work:Joint Work  

  • Kinetics of Chemical Vapor Deposition of WSix Films from WF6 and SiH2Cl2: Effect of added H2, SiH4, and Si2H6 Reviewed

    T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata and S. Yamaguchi

    Microelectronic Engineering 雑誌   Vol. 83   2006.10

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    Kind of work:Joint Work  

  • Kinetic study of Chemical Vapor Deposition of WSix films from WF6 and SiH2Cl2 : Determination of Molecular Size and Reactivity of Gas Species Reviewed

    T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi

    Thin Solid Films, 雑誌   ( 513 )   36 - 42   2006.08

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    Kind of work:Joint Work  

  • Electrical Properties of Diamond MISFETs with Submicron Gate on Boron-doped (111) Surface Reviewed

    T. Saito, K. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada and H Okushi

    Mater. Res. Soc. Symp. Proc. 雑誌   Vol.891   2006.03

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    Kind of work:Joint Work  

  • Fabrication of Diamond MISFET with Micron-sized Gate Length on Boron-doped (111) Surface Reviewed

    T. Saito, K. Park, K. Hirama, H. Umezawa, M. Satoh, H. Kawarada and H Okushi

    Diamond and Related Materials 雑誌   Vol.14   2043 - 2046   2005.04

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    Kind of work:Joint Work  

  • New Etching Process for Device Fabrication using Diamond Reviewed

    D.S. Hwang, T. Saito and N. Fujimori

    Diamond and Related Materials 雑誌   Vol.13   2207 - 2210   2004.04

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    Kind of work:Joint Work  

  • New Multi Layer Top Electrode of SRO/IrOx for 0.35um FRAM Reviewed

    Y. Horii, J. S. Cross, N. Sato, S. Ozawa, K. Matsuura, M. Fujiki, T. Saito, S. Mihara, T. Eshita, S. Sun, F. Chu, G. Fox, R. Bailey, T. Davenport and T. Yamazaki

    Extended Abstracts of 2002 International Conference on Solid State Devices and Materials 雑誌   84 - 85   2002.08

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    Kind of work:Joint Work  

  • Mass-Productive High Performance 0.5um Embedded FRAM Technology with Triple Layer Metal

    A. Itoh, Y. Hikosaka, T. Saito, H. Naganuma, H. Miyazawa, Y. Ozaki, Y. Kato, S. Mihara, H. Iwamoto, S. Mochizuki, M. Nakamura and T. Yamazaki

    Dig. Paper 2000 Symposium VLSI Technology 雑誌   32 - 33   2000.06

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    Kind of work:Joint Work  

  • Surface Morphology and Electrical Properties of Boron-Doped Diamond Films Synthesized by Microwave-Assisted Chemical Vapor Deposition using Trimethylboron on diamond (100) Substrate Reviewed

    T. Tsubota, T. Fukui, T. Saito, K. Kusakabe, S. Morooka and H. Maeda

    Diamond and Related Materials 雑誌   Vol. 9   1362 - 1368   2000.04

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    Kind of work:Joint Work  

  • Effect of Total Reaction Pressure on Electrical Properties of Boron Doped Homoepitaxial (100) Diamond Films Formed by Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron Reviewed

    T. Tsubota, T. Fukui, M. Kameta, T. Saito, K. Kusakabe, S. Morooka, H. Maeda

    Diamond and Related Materials 雑誌   8   1079 - 1082   1999.06

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    Kind of work:Joint Work  

  • Incorporation of Butyl Groups on Diamond Surface by Reactions in Organic Solvents Reviewed

    S. Morooka, S. Egawa, T. Tsubota, T. Saito, K. Kusakabe, H. Maeda

    New Diamond and Frontier Carbon Technology 雑誌   9   1999.03

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    Kind of work:Joint Work  

  • Synthesis and Electrical Properties of p-type Homoepitaxial (100) Diamond Films Formed by Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron Reviewed

    T. Tsubota, T. Fukui, T. Saito, K. Kusakabe, S. Morooka, H. Maeda

    New Diamond and Frontier Carbon Technology 雑誌   9   1999.03

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    Kind of work:Joint Work  

  • Electrical Properties of Homoepitaxial Boron-Doped Diamond Thin Films Grown by Chemical Vapor Deposition using Trimethylboron Reviewed

    S. Morooka, T. Fukui, K. Semoto, T. Tsubota, T. Saito, K. Kusakabe, H. Maeda, Y. Hayashi, T. Asano

    Diamond and Related Materials 雑誌   8   42 - 47   1999.01

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    Kind of work:Joint Work  

  • Epitaxial Nucleation of Diamond on Iridium Substrate by Bias Treatment in Microwave Plasma-Assisted Chemical Vapor Deposition Reviewed

    T. Saito, S. Tsuruga, N. Ohya, K. Kusakabe, S. Morooka, H. Maeda, A. Sawabe, K. Suzuki

    Diamond and Related Materials 雑誌   7   1381 - 1384   1998.09

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    Kind of work:Joint Work  

  • Morphology and Semiconducting Properties of Homoepitaxially Grown Phosphorus-Doped (100) and (111) Diamond Films by Microwave Plasma-Assisted Chemical Vapor Deposition Using Triethylphosphine As a Dopant Source Reviewed

    T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda, Y. Hayashi, T. Asano, A. Kawahara

    Journal of Crystal Growth 雑誌   191   723 - 733   1998.08

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    Kind of work:Joint Work  

  • Halogenation and Butylation of Diamond Surfaces by Reactions in Organic Solvents Reviewed

    Y. Ikeda, T. Saito, K. Kusakabe, S. Morooka, H. Maeda, Y. Taniguchi, Y. Fujiwara

    Diamond and Related Materials 雑誌   7   830 - 834   1998.06

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    Kind of work:Joint Work  

  • Synthesis and Electrical Properties of Phosphorus-Doped Homoepitaxial Diamond (111) by Microwave Plasma-Assisted Chemical Vapor Deposition Using Triethylphosphine as a Dopant Source

    T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda, Y. Hayashi, T. Asano

    Japanese Journal of Applied Physics 雑誌   37   L543 - L546   1998.05

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    Kind of work:Joint Work  

  • Incorporation of Butyl-Groups into Chlorinated Diamond Surface Carbons by Organic Reactions at Ambient Temperature Reviewed

    T. Saito, Y. Ikeda, S. Egawa, K. Kusakabe, S. Morooka, H. Maeda, Y. Taniguchi, Y. Fujiwara

    Journal of Chemical Society 雑誌   94   929 - 932   1998.04

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    Kind of work:Joint Work  

  • Synthesis of Phosphorus-Doped Homoepitaxial Diamond with Triethylphosphine by Microwave Plasma-Assisted Chemical Vapor Deposition Reviewed

    T. Saito, M. Kameta, K. Kusakabe, S. Morooka, H. Maeda

    Diamond and Related Materials 雑誌   7   560 - 564   1998.02

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    Kind of work:Joint Work  

  • Growth Behavior of Boron-Doped Diamond in Microwave Plasma-Assisted Chemical Vapor Deposition using Trimethylboron as the Dopant Source Reviewed

    H. Maeda, K. Ohtsubo, M. Kameta, T. Saito, K. Kusakabe, S. Morooka, T. Asano

    Diamond and Related Materials 雑誌   7   88 - 95   1998.01

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    Kind of work:Joint Work  

  • Improvement of Diamond Nuclei Orientation by Double Step Bias Treatment in Microwave Plasma assisted Chemical Vapor Deposition using C2H4 as Carbon Source Reviewed

    T. Saito, S. Tsuruga, H. Maeda, K. Kusakabe, S. Morooka

    Diamond and Related Materials 雑誌   6   668 - 672   1997.04

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    Kind of work:Joint Work  

  • Chemical Modification of Diamond Surfaces Reviewed

    Y. Ikeda, T. Saito, H. Maeda, K. Kusakabe, S. Morooka, Y. Taniguchi, Y. Fujiwara

    Theories and Applications of Chemical Engineering 雑誌   3   1223 - 1236   1997.02

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    Kind of work:Joint Work  

  • Synthesis of Ultrafine Titanium Diboride Particles by Rapid Carbothermal Reduction in a Particulate Transport Reactor Reviewed

    T. Saito, T. Fukuda, H. Maeda, K. Kusakabe, S. Morooka

    ournal of Materials Science 雑誌   32   1997.01

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    Kind of work:Joint Work  

  • Control of Selective Tungsten Chemical Vapor Deposition by Monolayer Nitridation of a Silicon Surface Reviewed

    S. Takami, M. Fujii, T. Saito, Y. Egashira, H. Komiyama

    Journal of the Electrochemical Society 雑誌 ECS   143   L38 - L40   1996.02

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    Kind of work:Joint Work  

  • TiCl4/NH3を原料としたTiN薄膜CVD合成の反応機構 Reviewed

    霜垣幸浩, 大久保頼聡, 齊藤丈靖, 江頭靖幸, 菅原活郎, 小宮山宏

    電子情報通信学会技術研究報告 雑誌   Vol.95 ( No. 497 )   1996.01

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    Kind of work:Joint Work  

  • Kinetic Study of WSix-CVD Processes - A Comparison of WF6/SiH4 and WF6/Si2H6 Reaction Systems- Reviewed

    T. Saito, Y. Shimogaki, Y. Egashira, H. Komiyama, K. Sugawara, K. Takahiro, S. Nagata, S. Yamaguchi

    Electronics and Communications in Japan 雑誌   Vol.78pt.2   1995.10

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    Kind of work:Joint Work  

  • バイアス処理による高配向ダイヤモンドの核発生 Reviewed

    前田英明, 丸井隆雄, 上野武夫, 齊藤丈靖, 草壁克己, 諸岡成治

    日本結晶成長学会誌 雑誌   37   329 - 333   1995.09

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    Kind of work:Joint Work  

  • WSix-CVDプロセスの反応機構 -WF6/SiH4, WF6/Si2H6反応系の比較- Reviewed

    齊藤丈靖, 霜垣幸浩, 江頭靖幸, 小宮山宏, 菅原活郎, 高広克己, 永田晋二, 山口貞衛

    電子情報通信学会論文誌C-II 雑誌   Vol.J78   1995.05

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    Kind of work:Joint Work  

  • WF6/Si2H6によるWSixブランケットCVDのモデリングとシミュレーション Reviewed

    江頭靖幸, 齊藤丈靖, 霜垣幸浩, 会田弘文, 小宮山宏, 菅原活郎

    電子情報通信学会論文誌C-II 雑誌   Vol.J78   1995.05

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    Kind of work:Joint Work  

  • WSix-CVDプロセスの反応機構 Reviewed

    霜垣幸浩, 齊藤丈靖, 大久保頼聡, 福村昌已, 江頭靖幸, 小宮山宏, 菅原活郎

    電子情報通信学会技術研究報告 雑誌   Vol.94 ( No. 469 )   1995.01

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    Kind of work:Joint Work  

  • Deposition of WSix Films from Preactivated Mixture of WF6/SiH4 Reviewed

    T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama, S. Nagata, K. Takahiro, S. Yamaguchi

    Japanese Journal of Applied Physics 雑誌   Vol.33   1994.01

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    Kind of work:Joint Work  

  • Existence of Extinction Temperature in WSix Film Growth from WF6 and SiH4 - An Indication of the Role Plaed by Radical Chain Reactions - Reviewed

    T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama, S. Nagata, K. Takahiro, S. Yamaguchi

    Applied Physics Letters 雑誌   Vol.62   1993.04

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    Kind of work:Joint Work  

  • The Conformal Deposition of WSix Films on Micron-sized Trenches - The Reactivity of Film Precursors as Species - Reviewed

    T. Saito, Y. Yuyama, Y. Egashira, Y. Shimogaki, K. Sugawara, H. Komiyama

    Applied Physics Letters 雑誌   Vol.61   1992.08

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    Kind of work:Joint Work  

  • The Reactivity and Molecular Size of Film Precursors during Chemical Vapor Deposition of Wsix Reviewed

    Y. Shimogaki, T. Saito, F. Tadokoro and H. Komiyama

    Journal de Physique IV, Colloque (France) 雑誌   Vol.1 ( No. C2 )   1991.01

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Books and Other Publications

  • 最新 実用真空技術総覧

    秋山安信、齊藤丈靖、渡辺文雄 他( Role: Joint author)

    エヌ・ティ・エス  2019.02  ( ISBN:978-4-86043-559-2

  • 6. 社会との垣根を越える大学の挑戦 -大阪府 立大学21世紀科学 研究機構の活動と実績-

    齊藤丈靖,岡本尚樹(分担執筆)( Role: Joint author)

    エヌ・ティ・エス  2011.12 

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    Responsible for pages:pp.275-297  

  • 改訂七版 化学工学便覧

    三浦 孝一 他( Role: Joint author)

    丸善出版  2011.09 

  • 熱力学 -基礎と演習-

    古南博,山下弘己,成澤雅紀,杉村博之,森口勇,森浩亮,田邉秀二,町田正人,齊藤丈靖( Role: Joint author)

    朝倉書店  2010.10 

Presentations

  • Electrical Properties of Reactive Sputtered Ti or V – based MAX alloy Thin Films International conference

    K Ueda, T. Saito

    2023 International Conference on Solid State Devices and Materials(SSDM2023)   2023.09  SSDM

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    Presentation type:Oral presentation (general)  

    Venue:Nagoya, Japan  

  • 金型製造プロセスにおけるNi電鋳の欠陥低減の検討 Domestic conference

    溝畑 凌生,岡本 尚樹,齊藤 丈靖

    化学工学会第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡、日本  

  • パルス電析法を用いたマグネシウム二次電池用Bi-Sn 負極材の評価 Domestic conference

    岡田 和寛,岡本 尚樹,齊藤 丈靖

    化学工学会第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡、日本  

  • パルス電析によるBi負極材の構造制御と充放電特性 Domestic conference

    松本 周,岡本 尚樹,齊藤 丈靖

    化学工学会第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡、日本  

  • 細胞増殖を促進する酸化亜鉛ナノ粒子の粒径最適化技法の構築 Domestic conference

    中島 壮一朗,清水 翔太,(阪公大高専) 倉橋 健介, (阪公大院理) 徳本 勇人,齊藤 丈靖

    化学工学会第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡、日本  

  • 反応性スパッタリングによるMAX合金薄膜形成と物性評価 Domestic conference

    上田 和貴 ,若松 和伸 ,齊藤 丈靖 , 岡本 尚樹

    化学工学会第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡、日本  

  • 乾式および湿式プロセスによる最先端半導体デバイス用極微細配線形成プロセスの現状 Domestic conference

    齊藤丈靖

    電気化学会第90 回大会  2023.03  電気化学会

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    Presentation type:Oral presentation (general)  

    Venue:仙台、日本  

  • Mg二次電池用Biアノードの析出形態制御と充放電特性 Domestic conference

    松本周,成本夏輝,岡本尚樹,齊藤丈靖

    化学工学会第53回秋季大会  2022.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:長野、日本  

  • パルスめっきによるBi負極材の析出形態制御と充放電特性 Domestic conference

    松本周,成本夏輝,岡本尚樹,齊藤丈靖

    第32回マイクロエレクトロニクスシンポジウム(MES2022)  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:堺、日本  

  • 反応性スパッタリングによるTi系MAX合金薄膜の物性に及ぼすA元素の効果 Domestic conference

    上田和貴,若松和伸,岡本尚樹,齊藤丈靖

    第32回マイクロエレクトロニクスシンポジウム(MES2022)  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:堺、日本  

  • 反応性スパッタリングによるMAX化合物薄膜形成とM元素の効果 Domestic conference

    若松和伸,上田和貴,岡本尚樹,齊藤丈靖

    第32回マイクロエレクトロニクスシンポジウム(MES2022)  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:堺、日本  

  • 有機シラン処理を用いたSi02上の極薄無電解NiB膜の平滑化 Domestic conference

    山田尚生,齊藤丈靖,岡本尚樹

    第32回マイクロエレクトロニクスシンポジウム(MES2022)  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:堺、日本  

  • Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material International conference

    T. Saito, K. Wakamatsu, K. Ueda, N. Okamoto

    2022 International Conference on Solid State Devices and Materials(SSDM2022)  2022.09  SSDM

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    Presentation type:Oral presentation (general)  

    Venue:Chiba, Japan  

  • Control of Surface Oxidation and Stress by Additives in Ni Electrodeposition International conference

    T. Saito, K. Yamada, R. Komoda, N. Okamoto

    2022 International Conference on Solid State Devices and Materials(SSDM2022)  2022.09  SSDM

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    Presentation type:Oral presentation (general)  

    Venue:Chiba, Japan  

  • 反応性スパッタリングによるTi系およびV系MAX合金薄膜の物性に及ぼすA元素とX元素の効果 Domestic conference

    齊藤丈靖

    第37回エレクトロニクス実装学会講演大会  2022.03  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:東京、日本  

  • Improvement of Charge/Discharge Characteristics with Surface Structure Controlled Bismuth Anode Materials by Electrodeposition for Magnesium-Ion Batteries International conference

    T. Saito, N. Narumoto and N. Okamoto

    2021 MRS Fall Meeting  2021.12 

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    Presentation type:Poster presentation  

  • Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition International conference

    N. Okamoto, M. Rindo, N. Yamada and T. Saito

    ADMETA plus 2021  2021.10 

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    Presentation type:Oral presentation (invited, special)  

  • Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evaluation of its electrochemical property International conference

    N. Okamoto, H. Tamura, T. Saito

    2021 International Conference on Solid State Devices and Materials   2021.09 

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    Presentation type:Poster presentation  

  • Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic propertelectrochemical and photocatalytic property International conference

    N. Okamoto, N. Matsuda. T. Saito

    2021 International Conference on Solid State Devices and Materials  2021.09  SSDM

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    Presentation type:Poster presentation  

  • Ni電析における添加剤による表面酸化と応力の制御 Domestic conference

    山田 紘平,薦田 凌輔,岡本 尚樹,齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2021.09 

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    Presentation type:Poster presentation  

  • 反応性スパッタリングによるTi系MAX合金配線材料の物性評価’ Domestic conference

    若松 和伸,上田 和貴,岡本 尚樹,齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2021.09 

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    Presentation type:Poster presentation  

  • Si熱酸化膜上の表面修飾による極薄無電解NiB膜の物性制御 Domestic conference

    岡本 尚樹,山田 尚生,林藤 壮史,齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2021.09 

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    Presentation type:Poster presentation  

  • 非水系および水系溶媒を用いた硫化鉄の電析による作製 Domestic conference

    岡本尚樹,田村 遥,齊藤丈靖

    表面技術協会第144回講演大会  2021.09 

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    Presentation type:Poster presentation  

  • 電析によるZnS の作製とCu ドーピングによる光学特性の制御’ Domestic conference

    岡本尚樹,松田直大,齊藤丈靖

    表面技術協会第144回講演大会  2021.09 

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    Presentation type:Poster presentation  

  • Pulsed Laser Deposition of Ti-Based MAX Compounds for Next-Generation Wiring Technology International conference

    K. Wakamatsu, T. Saito, and N. Okamoto

    239th ECS Meeting  2021.05 

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    Presentation type:Oral presentation (invited, special)  

  • Surface Structure Control and Charge/Discharge Characteristics of Bismuth Anode Materials By Electrodeposition for Magnesium-Ion Batteries International conference

    N. Narumoto, N. Okamoto, and T. Saito

    239th ECS Meeting  2021.05 

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    Presentation type:Poster presentation  

  • Comparative Study of Sheet Resistance Stability of Electro-Deposited Ni/Co – Alloy Thin Films

    •M. Rindo, N. Okamoto, T. Saito (Osaka Prefecture University), and A. Kitajima (The Institute of Scientific and Industrial Research Osaka University)

    239th ECS Meeting  2021.05 

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    Presentation type:Poster presentation  

  • Preparation of Furfural Resin-Based Active Carbon with Acid Treated Pore Surface Electric Double Layer Capacitor International conference

    •K. Hokari, S. Shimizu, N. Okamoto, T. Saito (Osaka Prefecture University), I. Ide, M. Nishikawa, and Y. Onishi (LIGNYTE. CO., LTD.)

    239th ECS Meeting  2021.05 

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    Presentation type:Poster presentation  

  • Low Temperature Deposition of TiB-based Hard Coating Films by Pulsed DC Plasma CVD International conference

    T. Saito

    ICMCTF 2021  2021.04 

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    Presentation type:Poster presentation  

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Charge of on-campus class subject

  • Advanced Internship in Chemical Engineering

    2021   Practical Training  

  • College of Engineering Internship

    2021   Practical Training  

  • Advanced Materials Process Engineering

    2021    

  • English Reading for Chemical Engineers

    2021    

  • Introduction to Physical Chemistry

    2021    

  • Chemical Engineering Thermodynamics

    2021    

  • Selected Topics in Materials Process Engineering

    2021    

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