Updated on 2024/03/18

写真a

 
OKAMOTO Naoki
 
Organization
Graduate School of Engineering Division of Science and Engineering for Materials, Chemistry and Biology Associate Professor
School of Engineering Department of Chemical Engineering
Title
Associate Professor
Affiliation
Institute of Engineering
Contact information
メールアドレス

Position

  • Graduate School of Engineering Division of Science and Engineering for Materials, Chemistry and Biology 

    Associate Professor  2022.04 - Now

  • School of Engineering Department of Chemical Engineering 

    Associate Professor  2022.04 - Now

Degree

  • 博士(工学) ( Others )

Research subject summary

  • 電気化学的手法を用いたNaイオン二次電池用材料の作製と評価

  • 電気化学的手法を用いた機能性薄膜および構造材の作製と構造解析

  • めっき膜に発生する欠陥の発生機構の解析

  • めっき電析時の電流密度分布の解析

Professional Memberships

  • Electrochemical Society(U.S.A)

    2005.04 - Now

  • エレクトロニクス実装学会

    2005.04 - Now

  • 表面技術協会

    2005.04 - Now

  • 日本金属学会

    2005.04 - Now

  • 化学工学会

    2005.04 - Now

Committee Memberships (off-campus)

  • 研究会実行委員   表面科学研究会  

    2023.04 - Now 

  • 関西表面技術フォーラム実行委員   表面技術協会  

    2023.04 - Now 

  • 関西支部幹事   表面技術協会  

    2023.04 - Now 

  • 学会誌編集委員   化学工学会  

    2023.04 - Now 

  • 表面技術協会関西支部幹事   表面技術協会  

    2022.04 - Now 

Awards

  • ADMETAPosterAward2016

    2017.10   ADMETA  

Papers

  • Organosilane Pretreatment for Roughness Improvement of Electroless NiB Films Reviewed

    Naoki Yamada, Takeyasu Saito, and Naoki Okamoto

    Proceedings of ADMETA2023   2023.10

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Reduction of Ni Electroforming Defects in the Mold Manufacturing Process for Diffractive Optical Elements and Study of Mold Stripping Method Reviewed

    Ryo Mizobata, Naoki Okamoto , Takeyasu Saito, Yuki Maeda

    2023.09

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    Authorship:Corresponding author   Publishing type:Research paper (international conference proceedings)   Kind of work:Joint Work   International / domestic magazine:Domestic journal  

  • Electrical Properties of Reactive Sputtered Ti or V - based MAX alloy Thin Films Reviewed

    ○ Kazuki Ueda, Kazunobu Wakamatsu, Takeyasu Saito, Naoki Okamoto

    Proceedings of SSDM2023   2023.09

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • Evaluation of Surface Functional Groups and Adhesion Strength to Heterogeneous Material of Epoxy-based Resin by UV Irradiations Reviewed

    Hina SHIRAKASHI, Takumi NISHIURA, Takeyasu SAITO, Shinichi ENDO, Yuki ISHIKAWA, Naoki OKAMOTO

    2023.09

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    Authorship:Last author   Publishing type:Research paper (international conference proceedings)  

  • Advances in Throwing Power Technology for Copper Plating Reviewed

    Ikuho MAEKAWA,Naoki OKAMOTO,Takeyasu SAITO,Yoshinobu YASUDA, Seiji KAMEMURA

    2023.09

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    Authorship:Corresponding author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:Domestic journal  

  • Synthesis of Pyrite from Organic Solvent bath by using Electrodeposition and evaluation of its electrochemical property Reviewed

    Naoki Okamoto , Haruka Tamura and Takeyasu Saito

    Proceedings of ADMETA2022 Plus   2022.10

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    Authorship:Lead author, Corresponding author   Publishing type:Research paper (international conference proceedings)   International / domestic magazine:International journal  

  • パルスめっきによるBi負極材の析出形態制御と充放電特性

    松本 周, 成本 夏輝, 岡本 尚樹, 齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム論文集   2022.09

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    International / domestic magazine:Domestic journal  

  • 反応性スパッタリングによるMAX化合物薄膜形成とM元素の効果

    若松 和伸,上田 和貴,岡本 尚樹,齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム論文集   2022.09

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    International / domestic magazine:Domestic journal  

  • 反応性スパッタリングによるTi系MAX合金薄膜の物性に及ぼすA元素の効果 Reviewed

    上田 和貴, 若松 和伸, 岡本 尚樹, 齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム論文集   2022.09

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    Publishing type:Research paper (other academic)   International / domestic magazine:Domestic journal  

  • 有機シラン処理を用いたSiO2上の極薄無電解NiB 膜の平滑化

    山田 尚生, 齊藤 丈靖, 岡本尚樹

    第31回マイクロエレクトロニクスシンポジウム論文集   2022.09

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  • Electrodeposition of ZnS and evaluation of its electrochemical property. Reviewed

    N. Okamoto, N. Matsuda and T. Saito

    J. J. Appl. Phys.   61   SC1075   2022.02

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  • Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition Reviewed

    Naoki Okamoto, Masashi Rindo, Naoki Yamada and Takeyasu Saito

    ADMETA2021 雑誌   2021.10

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    Kind of work:Joint Work  

  • Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evalu-ation of its electrochemical property Reviewed

    Naoki Okamoto, Haruka Tamura and Takeyasu Saito

    SSDM2021 雑誌   2021.09

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    Kind of work:Joint Work  

  • Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic property Reviewed

    Naoki Okamoto, Naohiro Matsuda and Takeyasu Saito

    Proceedings of SSDM2021 雑誌   2021.09

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    Kind of work:Joint Work  

  • Surface Structure Control and Charge/discharge Characteristics of Bismuth Anode Materials by Electrodeposition for Magnesium-Ion Batteries Reviewed

    Natsuki Narumoto, Naoki OKAMOTO, Takeyasu SAITO

    Journal of Materials Science: Materials in Electronics 雑誌   32   2021.03

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    Kind of work:Joint Work  

  • The Effect of Oxygen Content of ITO Bottom Electrode on Degradation Characteristics of (Pb, La) (Zr, Ti) O3 Capacitor. Reviewed

    T. Saito, Y. Ishida, A. Kobayashi, N. Okamoto, A. Kitajima, K. Norizawa

    International Interconnect Technology Conference 2020 (IEEE IITC 2020) 雑誌 IEEE   2020.10

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    Kind of work:Joint Work  

  • Physical Properties of Furfural Resin-Based Active Carbon for Improved Electric Double Layer Capacitor. Reviewed

    K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I. Ide, M. Nishikawa, Y. Onishi

    PRiME 2020 雑誌 ECS   2020.10

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    Kind of work:Joint Work  

  • Electrodeposition and Electrical Properties of Ni-Co Alloy Thin Films. Reviewed

    T. Saito, M. Rindo, N. Okamoto, A. Kitajima,

    International Interconnect Technology Conference 2020 (IEEE IITC 2020) 雑誌 IEEE   2020.10

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    Kind of work:Joint Work  

  • 電析法によるビスマス負極材の表面構造制御と充放電特性 Reviewed

    成本夏輝,岡本尚樹,齊藤丈靖

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   2020.09

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    Kind of work:Joint Work  

  • 酸素アニールによるITO電極表面状態と(Pb,La)(Zr,Ti)O 3 キャパシタの劣化特性 Reviewed

    石田裕紀,岡本尚樹,齊藤丈靖

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   2020.09

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    Kind of work:Joint Work  

  • 次世代ロジックデバイス配線に向けた無電解NiBめっき膜のバリア性能と電気特性評価 Reviewed

    林藤壮史,岡本尚樹,齊藤丈靖,北島彰

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   2020.09

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  • フラン樹脂由来活性炭への酸性表面官能基の導入と電気二重層キャパシタ特性 Reviewed

    清水翔太,帆苅奏,岡本尚樹,齊藤丈靖,井手勇,西川昌信,大西慶和

    第30回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   2020.09

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  • Structural Analysis of Furfural Resin-based Active Carbon to Control an Electric Double-layer Capacitor Reviewed

    K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I. Ide, M. Nishikawa, Y. Onishi

    Electrochemistry 雑誌 ECSJ   88 ( 3 )   2020.03

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    Kind of work:Joint Work  

  • Synthesis of Iron Sulfide by Using Electrodeposition Method and Discussion of the Influence of Solvent Reviewed

    H. Tamura, N. Okamoto, T. Saito

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   2019.12

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    Kind of work:Joint Work  

  • Highly Relaible (Pb,La)(Zr, Ti)O3 Ferroelectric Capacitor with Sputtered Sn-Doped In2O3 Electrode Reviewed

    T. Saito, A. Kobayashi, Y. Takada, N. Okamoto

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   2019.12

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    Kind of work:Joint Work  

  • ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed

    H. Kashima, N. Okamoto, T. Saito

    EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 雑誌   2019.12

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    Kind of work:Joint Work  

  • Electrodeposition of Cu doped ZnS and evaluation of its photocatalytic property Reviewed

    N. Matsuda, T. Saito, N. Okamoto

    Proc. of 2019 International Conference on Electronics Packaging (ICEP) 雑誌   2019.04

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    Kind of work:Joint Work  

  • Structural Analysis and Electric Double Layer Capacitor of Furfural Resin-Based Active Carbon with Different Particle Size Reviewed

    K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I.Ide, M. Nishikawa, Y. Onishi,

    Proc. of 2019 International Conference on Electronics Packaging, ICEP 2019 雑誌   2019.04

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    Kind of work:Joint Work  

  • Highly Relaible (Pb,La)(Zr, Ti)O3 Ferroelectric Capacitor with Sputtered Sn-Doped In2O3 Electrode Reviewed

    T. Saito, A. Kobayashi, Y. Takada, N. Okamoto

    Proc. of 2018 20th International Conference on Electronic Materials and Packaging 雑誌 EMAP   2018.12

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    Kind of work:Joint Work  

  • Synthesis of Iron Sulfide by using Electrodeposition Method and Discussion of the Influence of Solvent Reviewed

    H. Tamura, N. Okamoto, T. Saito

    Proc. of 2018 20th International Conference on Electronic Materials and Packaging 雑誌 EMAP   2018.12

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    Kind of work:Joint Work  

  • ZIF-8 Thin Films Growth with Al-Doped Zinc Oxide and 2-Methylimidazole through Gas-Solid Reaction Reviewed

    H. Kashima, N. Okamoto, T. Saito

    Proc. of 2018 20th International Conference on Electronic Materials and Packaging 雑誌 EMAP   2018.12

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    Kind of work:Joint Work  

  • First Principles Calculation of the Structure and Quantum Capacity of Acidic Functional Groups on Graphene-Based Capacitor Reviewed

    B. Li, T. Saito, N. Okamoto

    Proc. of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 ICEP-IAAC   2018.04

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  • Thermal Conductivity Measurement of Diamond and β-Ga2O3 Thin Films by a 3ω Method Reviewed

    S. Suzuki, S. Ohmagari, Y. Akutsu, N. Okamoto, T. Saito, H. Umezawa, Y. Mokuno

    Proc. of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 ICEP-IAAC   2018.04

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  • Electrodeposition of ZnS and Evaluation of its Optical Property Reviewed

    N. Okamoto, T. Saito, N. Matsuda

    Proc. of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 ICEP-IAAC   2018.04

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    Kind of work:Joint Work  

  • Synthesize of Negative Electrode Composed 3D Nano-Structures and Sn Based Material for Sodium Ion Secondary Battery Reviewed

    N. Okamoto, K. Kikuchi, K. Morita, T. Saito

    Proc. of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference 雑誌 ICEP-IAAC   2018.04

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  • Fabrication and Electrical Properties of (Pb,La)(Zr,Ti)O3 Capacitor with Pulsed Laser Deposited Sn-Doped In2O3 Bottom Electrode on Al2O3 (0001) Reviewed

    Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima

    Japanese Journal of Applied Physics 雑誌   56   2017.07

  • Sulfide Semiconductor Materials Prepared by High-Speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism Reviewed

    N. Okamoto* K. Kataoka T. Saito

    Jpn. J. Appl. Phys 雑誌 応用物理学会   56   2017.07

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  • Sn Negative Electrode Consists of Flexible 3D Structures for Sodium Ion Secondary Batteries Reviewed

    N. Okamoto, K. Morita and T. Saito

    ECS Trans. 雑誌 ECS   75 ( 22 )   59 - 66   2017.06

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  • Evaluation of Titanium Carbide Thin Film Coatings on WC-Co Following Surface Microstructure Treatments Reviewed

    C. Tanaka, T. Saito, N. Okamoto, S. Suzuki, A. Kitajima and K. Higuchi

    Materials and Corrosion 雑誌   68 ( 7 )   711 - 716   2017.02

  • Comparative Study of Hydrogen- and Deuterium-Induced Degradation of Ferroelectric (Pb,La)(Zr,Ti)O3 Capacitors Using Time-of-Flight Secondary Ion Measurement

    Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido

    IEEE Trans. Ultrason. Ferroelectr. Freq. Control 雑誌 IEEE   63 ( 10 )   1668 - 1673   2016.10

  • Sulfide Semiconductor Materials prepared by High-speed Electrodeposition and Discussion of Electrochemical Reaction Mechanism

    N. Okamoto, K. Kataoka and T. Saito

    ADMETA PLUS 2016 Proc. 雑誌 IEEE   44 - 45   2016.10

  • 電析法を用いた硫化物半導体の作製と電気化学測定による反応機構の考察 Reviewed

    岡本尚樹, 片岡健太郎, 齊藤丈靖

    第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   199 - 202   2016.09

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  • 電気化学的手法によるSn系Naイオン二次電池用負極材の作製 Reviewed

    岡本尚樹, 守田昴輝, 齊藤丈靖

    第26回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   195 - 198   2016.09

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  • Comparative study of ferroelectric (K,Na)NbO3 thin films pulsed laser deposition on platinum substrates with different orientation’ Reviewed

    R. Tamano, Y. Takada, N. Okamoto. T. Saito, K. Higuchi, A. Kitajima, T. Yoshimura, and N. Fujimura

    Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌   1 - 4   2016.08

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  • Evaluatioion of deuterium ion profile in (Pb,La)(Zr,Ti)O3 capacitors structures with conductive oxide top electrode by time of flight secondary ion mass spectrometry Reviewed

    Y. Takada, R. Tamano, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima and R. Shishido

    Proc. 2016 IEEE ISAF/ECAPD/PFM 雑誌   1 - 4   2016.08

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  • Fabrication of Doped Pb(Zr,Ti)O3 Capacitors on Pt Substrates with Different Orientations

    R. Tamano, T. Amano, Y. Takada, N. Okamoto, T. Saito, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima.

    Electronics Letters 雑誌   52 ( 16 )   1399 - 1401   2016.07

  • Al: ZnO top electrodes deposited with various oxygen pressures for ferroelectric (Pb, La)(Zr,Ti)O3 capacitors Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima

    Electronics Letters 雑誌 Electronics Letters   52   230 - 232   2016.05

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  • Ferroelectric Properties of (Pb,La)(Zr,Ti)O3 Capacitors Employing Al-doped ZnO Top Electrodes Prepared by Pulsed Laser Deposition under Different Oxygen Ressures Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima

    Japanese Journal of Applied Physics 雑誌   55 ( 6S3 )   2016.05

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  • Reliability of the properties of (Pb,La)(Zr,Ti)O3 capacitors with non–noble metal oxide electrodes stored in an H2 atmosphere

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, and R. Shishido

    MRS Advances 雑誌 MRS   1   369 - 374   2016.01

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  • Sn Negative Electrode Consists of Amorphous Structures for Lithium Ion and Sodium Ion Secondary Batteries Reviewed

    N. Okamoto, K. Morita, T. Fujiyama, T. Saito and K. Kondo

    MRS Advance 雑誌 MRS   1   409 - 414   2016.01

  • 電気化学的手法によるSn系Liイオン二次電池用負極材の作製 Reviewed

    岡本尚樹, 藤山貴友,中井那美, 岡田考史, 齊藤丈靖, 近藤和夫

    第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   247 - 250   2015.09

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  • 電気化学的手法を用いた硫化物半導体粒子の作製 Reviewed

    岡本尚樹, 片岡健太郎,神林 洸, 齊藤丈靖, 近藤和夫

    第25回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   243 - 246   2015.09

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  • Role of Cuprous Ion in Copper Electrodeposition Acceleration Reviewed

    T. Hayashi, S. Matsuura, K. Kondo, K Kataoka, K. Nishimura, M. Yokoi, T. Saito and N. Okamoto

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   162 ( 6 )   D199 - D203   2015.06

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  • Effect of Al-doped ZnO or Sn-doped In2O3 electrode on ferroelectric properties of (Pb,La)(Zr,Ti)O-3 capacitors Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito,K. Kondo, T. Yoshimura, N. Fujimura, N K. Higuchi, A. Kitajima and H. Iwai

    JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP   54 ( 5S )   83 - 87   2015.05

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  • The orientation controlled (Pb,La)(Zr,Ti)O3 capacitor for improved reliabilities Reviewed

    T. Saito, T. Amano, Y. Takada, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, and A. Kitajima

    Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌   226 - 229   2015.05

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  • Hydrogen profile measurement of (Pb,La)(Zr,Ti)O3 capacitor with conductive electrode after hydrogen annealing Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai, and R. Shishido

    Proc. 2015 IEEE ISAF/ISIF/PFM 雑誌   163 - 165   2015.05

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  • Electrochemical study of multi-component additive behavior during copper electrodeposition with a microfluidic device and an electrochemical quartz crystal microbalance

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    JAPANESE JOURNAL OF APPLIED PHYSICS 雑誌 JAP   54 ( 5S )   2015.05

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  • Effect of excess Pb on ferroelectric characteristics of conductive Al-doped ZnO and Sn-doped In2O3 top electrodes on PbLaZrTiOx capacitors Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima

    International Journal of Materials Research 雑誌   106 ( 1 )   83 - 87   2015.01

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  • The Effect of H2 Distribution in (Pb,La)(Zr,Ti)O3 Capacitors with Conductive Oxide Electrodes on the Degradation of Ferroelectric Properties Reviewed

    Y. Takada, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, H. Iwai

    Res. Soc. Symp. Proc. 雑誌   1729   93 - 98   2015.01

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  • Five-Minute TSV Copper Electrodeposition Reviewed

    K. Kondo, C. Funahashi, Y. Miyake, Y. Takeno, T. Hayashi , M. Yokoi, N. Okamoto and T. Saito

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   161 ( 14 )   D791 - D793   2014.12

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  • Improved reliability properties of (Pb,La) (Zr,Ti)O3 ferroelectric capacitors by thin aluminium-doped zinc oxide buffer layer Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi and A. Kitajima

    Electronics Letters 著書   50 ( 12 )   799 - 800   2014.11

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  • The Produced Cu+ Ionic Concentration Distribution Simulation inside the Via with PR Pulse Current Waveform Reviewed

    T. Hayashi, M. Yokoi, N. Okamoto, T. Sait and K. Kondo

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 雑誌 ECS   161 ( 12 )   D681 - D686   2014.11

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  • Electrochemical Study of the Multi-Component Additives Behavior during Copper Electrodeposition with a Microfluidic Device and an EQCM Reviewed

    Y. Tsujimoto, Y. Miyamoto, N. Okamoto, T. Saito and K. Kondo

    ADMETA plus 2014 Proc. 雑誌 IEEE   44 - 45   2014.10

  • Reduction of Thermal Expansion Coefficient of Electrodeposited Copper for TSV by Additive

    K. Kondo, C. Funahashi, T. Hayashi, M. Yokoi, N. Okamoto and T. Saito

    2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 雑誌 IEEE   306 - 308   2014.10

  • ビア底部の1価銅イオン濃度とめっき電流密度の関係 Reviewed

    林 太郎,濱崎公太,横井昌幸,岡本尚樹, 齊藤丈靖, 近藤和夫

    第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   383 - 386   2014.09

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    Kind of work:Joint Work  

  • 銅めっきにおける一価銅と添加剤による析出反応への影響 Reviewed

    西村光平,岡本尚樹, 齊藤丈靖,横井昌幸、近藤和夫

    第24回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   379 - 382   2014.09

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  • Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition Reviewed

    M. Takeuchi, Y. Anami, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, M. Yokoi and K. Kondo

    Electrochemistry 雑誌   82 ( 6 )   430 - 437   2014.06

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  • Adsorption behavior of poly(ethylene glycol) in the presence of two different kinds of halide ions, Br? and Cl? revealed using a microfluidic device and a flow cell type electrochemical quartz crystal microbalance Reviewed

    Y. Tsujimoto, Y. Miyamoto, T. Saito, N. Okamoto, K. Kondo

    Japanese Journal of Applied Physics 雑誌 JAP   53 ( 5 )   2014.05

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  • Aluminum-doped zinc oxide electrode for robust (Pb,La)(Zr,Ti)O3 capacitors - effect of oxide insulator encapsulation and oxide buffer layer - Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Journal of Materials Science: Materials in Electronics 雑誌   25 ( 5 )   2155 - 2161   2014.05

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  • A Behavior of Cuprous Intermediate in Copper Damascene Electrodeposition Reviewed

    K. Kondo, K. Hamazaki, M. Yokoi, N. Okamoto, T. Saito, T. Hayashi

    ECS Electrochemistry Letters 雑誌 ECS   3 ( 4 )   D3 - D5   2014.03

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  • 電気Niめっきにおける添加剤を用いたトレンチフィリングによる構造物の作製

    岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫

    エレクトロニクス実装学会誌 雑誌   17 ( 2 )   143 - 148   2014.03

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  • PRパルスパラメータ制御によるビア内部のCu+濃度分布とめっき形状の関係

    林太郎, R. Akolkar, 横井昌幸, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   221 - 224   2013.09

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  • 銅穴埋めめっきにおけるジアリルアミン系レベラー側鎖の影響

    山田康貴, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 横井昌幸, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   213 - 216   2013.09

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  • 微少流路型反応器を用いた異種ハロゲンイオン存在下におけるポリエチレングリコール吸着挙動の解析

    辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第23回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   217 - 220   2013.09

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  • Electrical properties of PbLaZrTiOx capacitors with conductive oxide buffer layer on Pt electrodes

    T. Saito, Y. Takada, T. Tsuji, N. Okamoto, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE   UFFC2013 - 002080   2013.07

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  • Comparative study of electrical properties of PbLaZrTiOx capacitors with Al-doped ZnO and ITO top electrodes

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    Proceedings of 2013 Joint UFFC, EFTF and PFM Symposium 雑誌 IEEE   UFFC2013 - 001587   2013.07

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  • Via filling electrodeposition of 4μm diameter via by periodical reverse current

    T.Hayashi,K.Kondo,M.Takauchi,T.Saito,N.Okamoto, M. Bunya and M. Yokoi

    ECS Transaction 雑誌 ECS   50 ( 32 )   29 - 37   2013.06

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  • Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition Reviewed

    H. Masaoka, T. Saito, K. Kondo, N. Okamoto, T. Kan

    ECS Transactions 雑誌 ECS   50   47 - 51   2013.06

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  • Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform Reviewed

    T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka, T. Tsuchiya

    Journal of the Electrochemical Society 雑誌   160 ( 6 )   D256 - D259   2013.06

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  • Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition

    H. Masaoka, T. Saito, K. Kondo, N. Okamoto, T. Kan

    ECS Transactions 雑誌 ECS   50 ( 46 )   47 - 51   2013.06

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  • The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes

    N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo

    ECS Transactions 雑誌 ECS   50 ( 32 )   19 - 26   2013.06

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  • Small Diameter Via Filling Electrodeposition by Periodical Reverse Current Reviewed

    T. Hayashi, K. Kondo, T. Saito, N. Okamoto, M. Yokoi, M. Takeuchi, M. Bunya, M. Marunaka and T. Tsuchiya

    ECTC2013 Proc. 雑誌 IEEE   1697 - 1702   2013.05

  • Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an Electrochemical Analysis with a Microfluidic Device and an Electrochemical Quartz Crystal Microbalance Reviewed

    T. Saito, Y. Miyamoto, S. Hattori, N. Okamoto, K. Kondo

    Japanese Journal of Applied Physics 雑誌   52 ( 5 )   2013.05

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  • Electrical properties of sol-gel derived PbLaZrTiOx capacitors with nonnoble metal oxide top electrodes

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Y. Fujimura, K. Higuchi, A. Kitajima, and A. Oshima

    ECS Transactions 雑誌 ECS   50 ( 34 )   43 - 48   2013.05

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  • Adsorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    Int. Conf. on Electronics Packaging 2013 Proc. 雑誌   639 - 644   2013.04

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  • The Wire Grid Polarizer made by Electro- and Electroless- Deposition Processes Reviewed

    N. Okamoto, Y. Ikeda, Y. Koyama, Y. Kawazu, T. Saito, K. Kondo

    ECS transactions 雑誌 ECS   50   2013

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  • Electrical properties of sol-gel derived PbLaZrTiOx capacitors with nonnoble metal oxide top electrodes Reviewed

    Y. Takada, T. Tsuji, N. Okamoto, T. Saito, K. Kondo, T. Yoshimura, N. Fujimura, K. Higuchi, A. Kitajima, A. Oshima

    ECS transactions 雑誌 ECS   50   2013

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  • Cu filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film Reviewed

    N. Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto, M. Hirota

    Electrochemica Acta 雑誌   82   2012.11

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  • The Organic Additives Effects during Electroless Nickel and Silver Deposition on Carbon Nanotube Reviewed

    T. Saito, Y. Takagi, N. Okamoto, K. Kondo, Y. Kobayashi, and Y. Fujiwara

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • Determination of Current Density Suppression Ability of Poly(ethylene glycol) during Copper Electrodeposition by an EQCM and a Microfluidic Device Reviewed

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    Advanced Metallization Conference 2012: 22nd Asian Session Tokyo, Proc. 雑誌   2012.10

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  • Low Temperature TiC Coating Process by Plasma Enhanced Chemical Vapor Deposition Reviewed

    H. Masaoka, S. Matsumoto, N. Okamoto, T. Saito, K. Kondo, and T. Kan

    ECS 222nd Meeting, Proc. 雑誌 ECS   2012.10

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  • 電解銅めっきにおけるPRパルス電流制御による直径4μmビア完全充填

    林太郎, 竹内実, 齊藤丈靖, 岡本尚樹, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   153 - 154   2012.09

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  • めっき法を用いた偏光子の作製

    岡本尚樹, 池田裕一, 小山義則, 齊藤丈靖, 近藤和夫, 河津泰幸

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   157 - 158   2012.09

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  • 急速液置換による銅めっき用有機添加剤の吸脱着挙動

    辻本悠一, 宮本豊, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   147 - 150   2012.09

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  • 電気Niめっきを用いた構造物の作製

    岡田考史, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第22回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   155 - 156   2012.09

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  • Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm Electroplating

    M.Takeuchi, K.Kondo, H.Kuri, M.Bunya, N.Okamoto, T.Saito

    ECS Transaction 雑誌 ECS   41 ( 43 )   2012.05

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  • Cu filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film Reviewed

    N.Okamoto, M.Miyamoto, T. Saito, K. Kondo, T. Fukumoto, M. Hirota

    Electrochimica Acta 雑誌 ISE   56   2012.05

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  • Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device Reviewed

    Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo

    Japanese Journal of Applied Physics 雑誌   51 ( 5 )   2012.05

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  • High Speed Copper Electrodeposition for Through Silicon Via(TSV) Reviewed

    T. Hayashi, *K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka, T. Tsuchiya, M. Bunya

    ECS Transactions 雑誌   41 ( 43 )   45 - 51   2012.05

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  • Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition Reviewed

    K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito

    J. Electrochem. Soc 雑誌 ECS   159 ( 4 )   2012.04

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  • 微小流路型反応器を利用した銅めっき液中添加剤作用の解析

    齊藤丈靖, 宮本 豊, 服部 直, 岡本 尚樹, 近藤和夫

    信学技報 雑誌   111   SDM2011 - 181   2012.03

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  • 3D Interconnected Technology by High Speed Copper Electrodeposition using Diallylamine Levelers

    T. Hayashi, K. Kondo, M. Takeuchi, Y. Suzuki, T. Saito, N. Okamoto, M. Marunaka

    3DIC, Proc 雑誌   2012.01

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  • High Speed Seamless Via Filling by Copper Electrodeposition

    T. Saito, Y. Tsujimoto, Y. Miyamoto, N. Okamoto, K. Kondo

    AEMAP2011, Proc. 雑誌   2011.12

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  • 平滑な電解銅箔の作製における添加剤の影響 Reviewed

    竹田依加, 岡本尚樹, 齊藤丈靖, 近藤和夫

    化学工学論文集 雑誌   37 ( 6 )   551 - 555   2011.11

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  • 急速液置換による銅めっき用有機系添加剤の吸脱着挙動解析

    宮本豊, 服部直, 齊藤丈靖, 岡本尚樹, 近藤和夫

    第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   61 - 64   2011.09

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  • Cu filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film Reviewed

    N. Okamoto, M. Miyamoto, Y. Niwa, T. Fukumoto, M. Hirota, T. Saito, K. Kondo

    The 62nd Annual Meeting of the International Society of Electrochemistry Proc. 雑誌 ISE   2011.09

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  • ジアリルアミン系レベラーを用いた銅穴埋めっき

    阿南善裕, 岡本尚樹, 齊藤丈靖, 近藤和夫, 竹内実, 文屋勝

    第21回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   141 - 144   2011.09

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  • Single dialylamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition

    M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. Saito

    Int. Conf. on Electronics Packaging 2011 Proc. 雑誌   2011.04

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  • Fabrication of Robust PbLa(Zr,Ti)O3 Capacitor Structures using Insulating Oxide Encapsulation Layers for FeRAM Integration Reviewed

    T. Saito,T. Tsuji,K..Izumi,Y. Hirota,N.Okamoto,K.Kondo, T. Yoshimura, N.Fujimura, A.Kitajima,A.Oshima

    Electronics Letters 雑誌   47   486 - 487   2011.03

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  • Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Aluminum Ion Additives Reviewed

    T. Saito, Y. Hirata, M. Oyanagi, N. Okamoto, K. Kondo

    Mater. Lett. 雑誌 elesevier   65   2826 - 2828   2011

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  • High-speed through silicon via(TSV) Filling using Diallylamine additive Reviewed

    T.Hayashi,K.Kondo,M.Takauchi,T.Saito,N.Okamoto

    JES 雑誌 ECS   158   2011

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  • ジアリルアミン添加剤を用いた銅穴埋めめっき Reviewed

    阿南善裕, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 近藤和夫

    表面技術 雑誌 表面技術学会   62 ( 12 )   2011

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  • Adosorption and desorption kinetic study of organic additives during copper electrodeposition by microfluidic reactor Reviewed

    Y. Miyamoto, S. Hattori, N. Okamoto, T. Saito, K. Kondo

    Int. Conf. on Electronics Packaging 2011 Proc 雑誌 エレクトロニクス実装学会   866 - 870   2011

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  • 銅穴埋めめっきにおけるジアリル系アミン添加剤の効果

    久利英之,岡本尚樹,齊藤丈靖,近藤和夫,文屋 勝,竹内 実

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   143 - 146   2010.09

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  • 三次元実装のための流水路構造の数値解析

    宮本 豊,齊藤丈靖,岡本尚樹,近藤和夫

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   179 - 183   2010.09

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  • 平滑電解銅箔の作製と添加剤の影響

    竹田依加,岡本尚樹,齊藤丈靖,近藤和夫

    第20回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   127 - 130   2010.09

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  • High Speed Through Silicon Via Filling by Copper Electrodeposition Reviewed

    K. Kondo, Y. Suzuki, T. Saito, N. Okamoto and M. Takeuchi

    Electrochemical and Solid State Letters 雑誌 ECS   13 ( 5 )   D26 - D28   2010.05

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  • 電解穴埋め銀めっきによるワイヤーグリッド偏光フイルムの作製 Reviewed

    近藤和夫, 小山義則, 齊藤丈靖, 岡本尚樹

    エレクトロニクス実装学会誌 雑誌 エレクトロニクス実装学会   14 ( 7 )   2010.05

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  • Improvement of Ferroelectric Properties by Non-noble-metal-oxide–electrode and Encapsulation Layer Reviewed

    K. Izumi, T. Tsuji, Y. Hirota, T. Saito, N. Okamoto, K. Kondo, T. Yoshimura and N. Fujimura

    Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌   113 - 114   2010.03

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  • Deposition of Metal Oxide Thin Film in Supercritical Carbon Dioxide Reviewed

    A. Kojima, Y. Hirota, N. Okamoto, T. Saito, K. Kondo and S. Takami

    Proc. of the 5th International Symposium on Material Cycling Engineering 雑誌   115 - 116   2010.03

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  • Molecular Scale Growth of Electrolytic Copper Foils Reviewed

    K. Kondo, N. Okamoto, T. Saito and M. Takeuchi

    ECS Transaction 雑誌 ECS   28   2010

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  • High Speed Copper Electrodeposition for Through Silicon Via(TSV) Reviewed

    K.Kondo, Y.Suzuki, T.Saito, N.Okamoto, M.Takeuchi

    Electrochemical and Solid State Letters 雑誌 ECS   13   2010

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  • 熱型赤外線センサ封止用ZnS窓材へのCu充填貫通配線 Reviewed

    福本貴文, 岡本尚樹, 太田最実, 福山康弘, 廣田正樹, 近藤和夫

    IEEJ Trans. 雑誌 IEEJ   130 ( 9 )   2010

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  • Shape Evolution of Electrodeposit Bumps with Shallow and Deep Cavities Reviewed

    K. Kondo Y. Suzuki, T. Saito, N. Okamoto and Y. Koyama

    J. Electrochem. Soc 雑誌 ECS   156 ( 12 )   D548 - D552   2009.12

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  • Shape Evolution of Electrodeposit Bumps with Shallow and Deep Cavities electrodeposition Reviewed

    K. Kondo Y. Suzuki, T. Saito, N. Okamoto and Y. Koyama

    J. Electrochem. Soc. 雑誌 ECS   156 ( 12 )   D548 - D552   2009.12

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  • Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally-Deposited Sn Films Reviewed

    N. Okamoto,Y. Fujii, H. Kurihara and K. Kondo

    Materials Transactions 雑誌 The Japan Insitute of Metal   50 ( 11 )   2570 - 2577   2009.11

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  • Effects of Structures of Substrates on Sn Whisker Formation Using Substitutionally - Deposited Sn Films Reviewed

    N. Okamoto, Y. Fujii, H. Kurihara and K. Kondo

    Materials Transactions 雑誌 The Japan Insitute of Metal   50 ( 10 )   2403 - 2409   2009.10

  • Correlation between Cu(I)-complexes and filling of via cross sections by copper electrodeposition Reviewed

    K. Kondo, T. Nakamura and N. Okamoto

    J. Appl. Electrochem. 雑誌   39 ( 10 )   1789 - 1795   2009.10

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  • Amorphous Carbon Film Deposition for Hydrogen Barrier in FeRAM Integration by Radio Frequency Plasma Chemical Vapor Deposition Method Reviewed

    T. Saito, K. Izumi, Y. Hirota, N. Okamoto, K. Kondo, T. Yoshimura and N. Fujimura

    ECS Transaction 雑誌 ECS   25 ( 8 )   693 - 698   2009.08

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  • High Adhesive Strength Ni-P Thin Film on ZnS by an Electroless Deposition Reviewed

    N.Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto and M. Hirota

    Electrochemical and Solid State Letters 雑誌 ECS   13 ( 6 )   J74 - 76   2009.06

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  • High-Aspect Ratio Copper-Via Filling for Three Dimensional Chip Stacking Reviewed

    K. Kondo, Y. Suzuki, T. Saito, N. Okamoto and M. Marunaka

    ECTC Proc. 雑誌 ECTC   2009.06

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  • High Speed Through Silicon Via Filling by Copper Electrodeposition Reviewed

    K. Kondo, Y. Suzuki, T. Saito, N. Okamoto and M. Takauchi

    Electrochemical and Solid State Letters 雑誌 ECS   13 ( 5 )   D26 - D28   2009.05

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  • A Rotating Ring Disk Electrode (RRDE) Study of Cuprous Thiolate Accelerant Produced by Copper Dissolution Reviewed

    S. Hattori, D. P. Barkey, K. Kondo, T. Saito and N. Okamoto

    Int. Conf. on Electronics Packaging 2009 Proc. 雑誌 JIEP   931 - 934   2009.05

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  • Effect of New Levelers for Cu Via-Filling

     

    Int. Conf. on Electronics Packaging 2009 Proc. 雑誌 JIEP   919 - 922   2009.05

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  • Numerical Analysis of Transport Phenomena in High Aspect Cavity for Bump Formation Reviewed

    Y. Koyama, Y. Suzuki, N. Okamoto, T. Saito and K. Kondo

    Int. Conf. on Electronics Packaging 2009 Proc. 雑誌 JIEP   915 - 918   2009.05

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    Kind of work:Joint Work  

  • Preparation of Smooth Zinc Oxide Thin Film via Liquid Phase Reaction with Cation Additives Reviewed

    T. Saito, Y. Hirata, N. Okamoto and K. Kondo

    Materials Research Society Symposium Proceedings 雑誌 MRS   ( 1113E )   2009.05

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    Kind of work:Joint Work  

  • CaBi4Ti4O15 Thin Film Deposition on Electroplated Platinum Substrates using a Sol-gel Method Reviewed

    T. Saito, Y. Hirota, M. Ooyanagi, N. Okamoto, K. Kondo, T. Yoshimura and N. Fujimura

    Materials Research Society Symposium Proceedings 雑誌 MRS   2009.05

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    Kind of work:Joint Work  

  • 3. 無電解Snめっき膜上に形成されるウィスカ発生に対するSnめっき膜の結晶粒径と基板の結晶配向性の影響 Reviewed

    岡本尚樹, 藤井祐子, 栗原宏明, 近藤和夫

    日本金属学会誌 雑誌 日本金属学会   73 ( 2 )   116 - 123   2009.02

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    Kind of work:Joint Work  

  • Formation Factor of Nodule by Copper Electrodeposition Reviewed

    N. Okamoto, S. Takahashi, T. Saito, K. Kondo

    ECS Transactions 雑誌 ECS   16   2009.02

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    Kind of work:Joint Work  

  • トレンチ内へのニッケルめっき膜の作成 Reviewed

    安宅一泰, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   163 - 166   2008.09

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    Kind of work:Joint Work  

  • Ni-Co合金の微小構造物の作製 Reviewed

    山田雅士, 岡本尚樹, 齊藤丈靖, 近藤和夫

    第18回マイクロエレクトロニクスシンポジウム論文集 雑誌 エレクトロニクス実装学会   159 - 162   2008.09

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    Kind of work:Joint Work  

  • PR電解を用いた銅穴埋めめっき Reviewed

    近藤和夫, 福田良, 齊藤丈靖, 岡本尚樹, 伊藤潔

    表面技術 雑誌 表面技術協会   59 ( 9 )   627 - 632   2008.09

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    Kind of work:Joint Work  

  • 無電解Snめっき膜上に形成されるウィスカ発生に対する基板の影響 Reviewed

    岡本 尚樹, 藤井 祐子, 栗原 宏明, 近藤 和夫

    日本金属学会誌 雑誌 日本金属学会   72 ( 6 )   413 - 419   2008.06

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    Kind of work:Joint Work  

  • 無電解Snめっき膜より発生したウィスカの形態 Reviewed

    岡本 尚樹, 藤井 祐子, 栗原 宏明, 近藤 和夫

    エレクトロニクス実装学会誌 雑誌 エレクトロニクス実装学会   10 ( 4 )   286 - 290   2007.07

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    Kind of work:Joint Work  

  • ガラス基板上の無電解Cuめっき膜の密着性と初期析出状態に対する触媒核の分布状態の影響 Reviewed

    岡本 尚樹, 木村 隆, 渡辺 徹

    日本金属学会誌 雑誌   69 ( 7 )   502 - 508   2005.07

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    Kind of work:Joint Work  

  • 置換めっき法によりCu基板上に形成されたPd-Cu合金膜の構造 Reviewed

    岡本 尚樹, 渡辺 徹

    日本金属学会誌 雑誌 日本金属学会   69 ( 5 )   429 - 432   2005.05

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    Kind of work:Joint Work  

  • 置換Au, Ag, Pdめっき膜の密着性 Reviewed

    岡本 尚樹, 渡辺 徹

    日本金属学会誌 雑誌 日本金属学会   69 ( 2 )   225 - 228   2005.02

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    Kind of work:Joint Work  

  • Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates Reviewed

    N.Okamoto, F.Wang, T.Watanabe

    Materials Transactions 雑誌 The Japan Insitute of Metal   45 ( 12 )   3330 - 3333   2004.12

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    Kind of work:Joint Work  

  • めっき膜の密着性 Ⅰ.Cu, Ni, Ag上のCu, Ni, Agめっき膜の密着性Ⅱ.ガラス基板上に作製した無電解Cuめっき膜の密着性 Reviewed

    岡本 尚樹, 木村 隆, 渡辺 徹

    ナノプレーティング 雑誌   ( 10 )   2004.10

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    Kind of work:Joint Work  

  • Adhesion of Electrolessdeposited Copper Films on Glass Substrates Reviewed

    N.Okamoto, T.Watanabe

    Proc. of 55th International Annual Meeting of International Society of Electrochemistry 雑誌   2004.09

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    Kind of work:Joint Work  

  • 二液法活性化前処理により非導電性基板上に形成される吸着物と無電解Ni-Pめっき初期析出物の微視的形態 Reviewed

    山岸 憲史, 岡本 尚樹, 鵜川 博之, 福室 直樹, 八重 真治, 松田 均

    表面技術 雑誌 表面技術協会   55 ( 6 )   417 - 421   2004.06

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    Kind of work:Joint Work  

  • Nanostructured L10 Co-Pt alloy thin films by an electrodepositon process Reviewed

    F.Wang, K.Hosoiri, S.Doi, N.Okamoto, T.kuzushima, T.Totsuka, T.Watanabe

    Electrochemistry Communications 雑誌   6 ( 11 )   1149 - 1152   2004.06

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    Kind of work:Joint Work  

  • Reaction Mechanism of Two-step Catalyzation for Electroless Plating on Non-conducting Substrates Reviewed

    K.Yamagishi, N. Okamoto, N. Mitsumata, N. Fukumuro, S.Yae, H.Matsuda

    Transactions of the Institute of Metal Finishing 雑誌   82 ( 5 )   114 - 117   2004.05

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    Kind of work:Joint Work  

  • 無電解めっきの活性化前処理に用いられるセンシタイジング液の経時変化 Reviewed

    岡本 尚樹, 八重 真治, 山岸 憲史, 三俣 宣明, 福室 直樹, 渡辺 徹, 松田 均

    表面技術 雑誌 表面技術協会   55 ( 4 )   281 - 285   2004.04

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    Kind of work:Joint Work  

  • Adhesion of Electrodeposited Copper, Nickel and Silver Films on Different Metallic Substrates Reviewed

    N.Okamoto, T.Watanabe

    Proc. of International Symposium on Advanced Materials and their Related Science 雑誌   2003.10

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    Kind of work:Joint Work  

  • 無電解めっきの二液法活性化前処理により非導電性基板上に形成される吸着物 Reviewed

    山岸 憲史, 八重 真治, 岡本 尚樹, 福室 直樹, 松田 均

    表面技術 雑誌 表面技術協会   54 ( 2 )   150 - 154   2003.02

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    Kind of work:Joint Work  

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Books and Other Publications

  • イソギンチャク型微細構造物を形成する表面処理の特徴と応用

    岡本 尚樹( Role: Sole author)

    日刊工業新聞社  2021.02 

  • 次世代電池用電極材料の高エネルギー密度、高出力化

    岡本 尚樹、他( Role: Joint author)

    情報技術協会  2017.10 

  • 6. 社会との垣根を越える大学の挑戦 -大阪府 立大学21世紀科学 研究機構の活動と実績-

    齊藤丈靖,岡本尚樹(分担執筆)( Role: Joint author)

    エヌ・ティ・エス  2011.12 

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    Responsible for pages:pp.275-297  

MISC

  • めっきを応用した化合物半導体・立体構造物の創製 International journal

    岡本尚樹

    日刊工業新聞   2022.12

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    Authorship:Lead author, Corresponding author   Publishing type:Article, review, commentary, editorial, etc. (trade magazine, newspaper, online media)   International / domestic magazine:Domestic journal  

  • 研究室紹介:微細化する配線技術から次世代電池まで、気相成長や電析を駆使して機能性材料の創製に挑戦(アカデミアシリーズ:第78回) Reviewed

    岡本尚樹,齊藤丈靖

    日本鍍金材料協同組合   53 ( 7 )   2020.07

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Presentations

  • Organosilane Pretreatment for Roughness Improvement of Electroless NiB Films

    Naoki Yamada, Takeyasu Saito, and Naoki Okamoto

    ADMETA2023  2023.10  ADMETA

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    Presentation type:Oral presentation (general)  

    Venue:Tokyo,Japan  

  • パルス電析によるBi負極材の構造制御と充放電特性 Domestic conference

    松本 周, 岡本 尚樹, 齊藤 丈靖

    化学工学会 第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡大学  

  • 金型製造プロセスにおけるNi電鋳の欠陥低減の検討 Domestic conference

    溝畑 凌生, 岡本 尚樹, 齊藤 丈靖, 前田 有希, 前川 聡

    化学工学会 第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡大学  

  • 電析法で作製したZnSへの電気化学的Cuドーピングの検討 Domestic conference

    岡本 尚樹, 松田 直大, 齊藤 丈靖

    化学工学会 第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡大学  

  • アルカリ水溶液中に分散したグラフェンに対する電気化学反応の考察 Domestic conference

    岡本 尚樹, 三宅 怜, 齊藤 丈靖

    化学工学会 第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡大学  

  • パルス電析法を用いたマグネシウム二次電池用Bi-Sn 負極材の評価 Domestic conference

    岡田 和寛, 岡本 尚樹, 齊藤 丈靖

    化学工学会 第54回秋季大会  2023.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:福岡大学  

  • UV処理したエポキシ系樹脂の表面官能基評価と異種界面の密着性 International conference

    白樫 陽菜、西浦 拓海、齊藤 丈靖、遠藤 真一 、石川 有紀 、岡本 尚樹

    第33回マイクロエレクトロニクスシンポジウム  2023.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大同大学  

  • Electrical Properties of Reactive Sputtered Ti or V - based MAX alloy Thin Films International conference

    Kazuki Ueda, Kazunobu Wakamatsu, Takeyasu Saito, Naoki Okamoto

    SSDM2023  2023.09  SSDM

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    Presentation type:Oral presentation (general)  

    Venue:Nagoya,Japan  

  • 銅めっきの均一電着性技術の向上 International conference

    前川 育穂、岡本 尚樹、斎藤 丈靖、安田 吉伸、亀村 誠司

    第33回マイクロエレクトロニクスシンポジウム  2023.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大同大学  

  • 回折光学素子用金型製造プロセスにおけるNi電鋳の欠陥低減と剥離法の検討 International conference

    溝畑 凌生,岡本 尚樹,齊藤 丈靖,前田 有希

    第33回マイクロエレクトロニクスシンポジウム  2023.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大同大学  

  • 水溶液中に分散したグラフェンの電気化学挙動に関する考察 Domestic conference

    三宅 怜、齊藤丈靖、岡本尚樹

    第24回関西表面技術フォーラム  2022.11  表面技術協会

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    Presentation type:Oral presentation (general)  

    Venue:甲南大学  

  • Synthesis of Pyrite from Organic Solvent bath by using Electrodeposition and evaluation of its electrochemical property International conference

    Naoki Okamoto, Haruka Tamura and Takeyasu Saito

    ADMETA2022  2022.10  ADMETA

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    Presentation type:Poster presentation  

    Venue:Tokyo,Japan  

  • Mg二次電池用Biアノードの析出形態制御と充放電特性 Domestic conference

    松本 周, 成本 夏輝, 岡本 尚樹, 齊藤 丈靖

    化学工学会第53回秋季大会  2022.09  化学工学会

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    Presentation type:Oral presentation (general)  

    Venue:信州大学  

  • パルスめっきによるBi負極材の析出形態制御と充放電特性 Domestic conference

    松本 周, 成本 夏輝, 岡本 尚樹, 齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大阪公立大学  

  • 反応性スパッタリングによるMAX化合物薄膜形成とM元素の効果 Domestic conference

    若松 和伸,上田 和貴,岡本 尚樹,齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大阪公立大学  

  • 有機シラン処理を用いたSiO2上の極薄無電解NiB 膜の平滑化 Domestic conference

    山田 尚生, 齊藤 丈靖, 岡本尚樹

    第31回マイクロエレクトロニクスシンポジウム  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大阪公立大学  

  • 反応性スパッタリングによるTi系MAX合金薄膜の物性に及ぼすA元素の効果 Domestic conference

    上田 和貴, 若松 和伸, 岡本 尚樹, 齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2022.09  エレクトロニクス実装学会

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    Presentation type:Oral presentation (general)  

    Venue:大阪公立大学  

  • Fabrication and electrical properties of Ni-B thin film onto SiO2 by electroless deposition International conference

    Naoki Okamoto, Masashi Rindo, Naoki Yamada and Takeyasu Saito

    ADMETA2021  2021.10  ADMETA

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    Presentation type:Poster presentation  

  • Electrodeposition of Cu doped ZnS and evaluation of its electrochemical and photocatalytic property International conference

    Naoki Okamoto, Naohiro Matsuda and Takeyasu Saito

    SSDM2021  2021.09  応用物理学会

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    Presentation type:Poster presentation  

  • Synthesis of Pyrite from Aqueous Solution by using Electrodeposition and evaluation of its electrochemical property International conference

    Naoki Okamoto, Haruka Tamura and Takeyasu Saito

    SSDM2021  2021.09  応用物理学会

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    Presentation type:Poster presentation  

  • 電析によるZnSの作製とCuドーピングによる光学特性の制御 Domestic conference

    岡本尚樹,松田直大,齊藤 丈靖

    表面技術協会第144回講演大会  2021.09  表面技術協会

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  • 非水系および水系溶媒を用いた硫化鉄の電析による作製 Domestic conference

    岡本 尚樹、田村 遥、齊藤 丈靖

    表面技術協会第144回講演大会  2021.09  表面技術協会

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  • Ni電析における添加剤による表面酸化と応力の制御 Domestic conference

    山田 紘平、薦田 凌輔、岡本 尚樹、齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2021.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • 反応性スパッタリングによるTi系MAX合金配線材料の物性評価 Domestic conference

    若松 和伸、上田 和貴\、岡本 尚樹、齊藤 丈靖

    第31回  2021.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • Si熱酸化膜上の表面修飾による極薄無電解NiB膜の物性制御 Domestic conference

    岡本 尚樹、山田 尚生、林藤 壮史、齊藤 丈靖

    第31回マイクロエレクトロニクスシンポジウム  2021.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • ダイヤモンドモザイク基板上への高濃度ホウ素ドーピングと均一性評価 Domestic conference

    冨士和樹,岡本尚樹,齊藤丈靖,嶋岡毅紘,大曲新矢,山田英明

    第68回応用物理学会春季学術講演会  2021.03  応用物理学会

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  • 極薄無電解NiB膜のめっき前処理におけるNH2化とバリア性能評価 Domestic conference

    林藤壮史,岡本尚樹,齊藤丈靖,北島彰

    第68回応用物理学会春季学術講演会  2021.03  応用物理学会

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  • Electrodeposition and Electrical Properties of Ni-Co Alloy Thin Films. International conference

    T. Saito, M. Rindo, N. Okamoto, A. Kitajima,

    International Interconnect Technology Conference 2020 (IEEE IITC 2020)  2020.10  IEEE

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  • The Effect of Oxygen Content of ITO Bottom Electrode on Degradation Characteristics of (Pb, La) (Zr, Ti) O3 Capacitor. International conference

    T. Saito, Y. Ishida, A. Kobayashi, N. Okamoto, A. Kitajima, K. Norizawa

    International Interconnect Technology Conference 2020 (IEEE IITC 2020)  2020.10  IEEE

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  • Physical Properties of Furfural Resin-Based Active Carbon for Improved Electric Double Layer Capacitor. International conference

    K. Hokari, S. Suzuki, N. Okamoto, T. Saito, I. Ide, M. Nishikawa, Y. Onishi

    PRiME 2020  2020.10  ECS

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    Presentation type:Poster presentation  

  • Mg二次電池用負極としてのビスマス薄膜の電析 Domestic conference

    成本夏輝,岡本尚樹,齊藤丈靖

    化学工学会第51回秋季大会  2020.09  化学工学会

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    Presentation type:Poster presentation  

  • 電析法によるビスマス負極材の表面構造制御と充放電特性 Domestic conference

    成本夏輝,岡本尚樹,齊藤丈靖

    第30回マイクロエレクトロニクスシンポジウム  2020.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • 酸素アニールによるITO電極表面状態と(Pb,La)(Zr,Ti)O 3 キャパシタの劣化特性 Domestic conference

    石田裕紀,岡本尚樹,齊藤丈靖

    第30回マイクロエレクトロニクスシンポジウム  2020.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • 次世代ロジックデバイス配線に向けた無電解NiBめっき膜のバリア性能と電気特性評価 Domestic conference

    林藤壮史,岡本尚樹,齊藤丈靖,北島彰

    第30回マイクロエレクトロニクスシンポジウム  2020.09  エレクトロニクス実装学会

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    Presentation type:Poster presentation  

  • フラン樹脂由来活性炭への酸性表面官能基の導入と電気二重層キャパシタ特性 Domestic conference

    清水翔太,帆苅奏,岡本尚樹,齊藤丈靖,井手勇,西川昌信,大西慶和

    第30回マイクロエレクトロニクスシンポジウム(  2020.09  エレクトロニクス実装学会

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Industrial Property Rights

  • めっき基板の製造方法

    岡本 尚樹, 宮本 めぐみ, 福本 貴文, 廣田 正樹

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    property_type:Patent 

  • 銅充填方法

    岡本 尚樹, 近藤 和夫, 久利 英之, 文屋 勝, 竹内 実

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    property_type:Patent 

  • 電気Fe-Ni合金めっき方法及びFe-Ni合金めっき構造体

    岡本 尚樹, 土肥 茂史, 中村 芳春, 戸根 薫, 岩野 博, 鈴村 正彦

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    property_type:Patent 

Outline of collaborative research (seeds)

  • めっき法を用いた機能性薄膜および構造材の作製

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    めっき法を用いて機能性薄膜および構造材の作製を行う.それにより,磁気特性,機械的強度など材料特性だけでなく生産性に優れた薄膜の作製プロセスの構築を検討する.同時に,構造解析を行い物理的・機械的特性等に優れた薄膜を作製する.

  • めっき膜に発生する欠陥の発生機構の解析

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    めっき膜に発生する欠陥(ウィスカ,ノジュール等の以上析出物やめっき膜の剥離等)の発生機構について検討する.そのために,欠陥発生時のめっき膜の構造解析,不純物のめっき膜内部での拡散状態,溶液内での添加剤の作用機構などを多角的に研究する.

  • めっき電析時の電流密度分布の解析

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    微小めっきプロセスでの電流密度分布の解析.電析によりめっき膜が形成される過程での電流密度分布の数値解析を行い,電極形状によるめっき膜の不均一性の発現機構や電子部品等で重要となる均一性の向上について研究を行う.

Charge of on-campus class subject

  • Analytical Chemistry B

    2021    

  • Advanced Materials Process Engineering

    2021    

  • Chemical Engineering Practice

    2021   Practical Training  

  • First Year Seminar

    2021    

  • Laboratory: Chemical Engineering I

    2021   Practical Training  

Number of papers published by graduate students

  • 2023

    Number of undergraduate student / college student presentations:Number of graduate students presentations:4

  • 2022

    Number of undergraduate student / college student presentations:Number of graduate students presentations:5

  • 2021

    Number of undergraduate student / college student presentations:Number of graduate students presentations:4

Number of instructed thesis, researches

  • 2023

    Number of instructed the graduation thesis:Number of graduation thesis reviews:4

    [Number of instructed the Master's Program] (previous term):[Number of instructed the Master's Program] (letter term):0

    [Number of master's thesis reviews] (chief):[Number of master's thesis reviews] (vice-chief):4

    [Number of doctoral thesis reviews] (chief):[Number of doctoral thesis reviews] (vice-chief):0

  • 2022

    Number of instructed the graduation thesis:Number of graduation thesis reviews:4

    [Number of instructed the Master's Program] (previous term):[Number of instructed the Master's Program] (letter term):0

    [Number of master's thesis reviews] (chief):[Number of master's thesis reviews] (vice-chief):5

    [Number of doctoral thesis reviews] (chief):[Number of doctoral thesis reviews] (vice-chief):0

  • 2021

    Number of instructed the graduation thesis:Number of graduation thesis reviews:5

    [Number of instructed the Master's Program] (previous term):[Number of instructed the Master's Program] (letter term):0

    [Number of master's thesis reviews] (chief):[Number of master's thesis reviews] (vice-chief):4

    [Number of doctoral thesis reviews] (chief):[Number of doctoral thesis reviews] (vice-chief):0

  • 2020

    Number of instructed the graduation thesis:

Media Coverage

  • めっきを応用した化合物半導体・立体構造物の創製 Newspaper, magazine

    日刊工業新聞社  日刊工業新聞  2022.12

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    SDGs:

Academic Activities

  • Materials Science in Semiconductor Processing

    Role(s): Peer review

    Materials Science in Semiconductor Processing  2022.10 - Now

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    Type:Peer review 

  • Advances in Manufacturing

    Role(s): Peer review

    Advances in Manufacturing  2022.07 - 2022.08

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    Type:Peer review 

  • 第31回マイクロエレクトロニクスシンポジウム実行副委員長

    Role(s): Planning, management, etc., Panel moderator, session chair, etc.

    エレクトロニクス実装学会  2022.04 - Now

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    Type:Competition, symposium, etc.